Flexible Thinking: Designing Flex Circuits for Dynamic Reliability
Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Aismalibar to Showcase Thermal Management Solutions for EV Battery Systems at The Battery Show North America 2024
September 27, 2024 | AismalibarEstimated reading time: 1 minute
Aismalibar, a leader in innovative thermal management materials, will be presenting its newest solutions for electric vehicle (EV) battery systems at The Battery Show North America from October 7-11, 2024. Located at Huntington Place, Detroit, MI, Aismalibar will exhibit at booth 6231, unveiling a range of cutting-edge Thermal Interface Materials (TIMs) designed to improve the safety, performance, and longevity of EV batteries.
- Thermal Interface Materials (TIMs): Aismalibar will introduce its new generation of high-performance TIMs, BOND SHEET CURED GLASS FREE, which provide outstanding thermal conductivity and durability, critical for the growing needs of high-power-density applications. These materials are designed to bridge gaps between heat-generating components and heatsinks, ensuring optimal heat dissipation in EV battery packs and other high-performance electronics.
- Thermal FR4 (CCLs): HTC 3.2w HIGH TG BOND SHEETS AND THIN LAM are used in PCB manufacturing to improve thermal management and reduce thermal vias. The use of Aismalibar's thermal FR4 can reduce the operating temperature of power components by up to 20%, which will result in improved output and extended lifespan.
- Insulated Metal Substrates (IMS): Aismalibar will also feature its latest IMS solutions, COBRITHERM ULTRATHIN 5W and 8W, designed for applications requiring both electrical insulation and efficient thermal conductivity. These substrates are ideal for power electronics, enabling manufacturers to manage higher power outputs without compromising system stability or lifespan.
Aismalibar invites attendees to booth 6231 to explore these groundbreaking thermal management solutions and learn more about how they can enhance the performance of EV batteries. Our team of experts will be available to discuss how Aismalibar’s innovations can support the evolving needs of the electric vehicle industry.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Teledyne FLIR Defense Wins $35+ Million Surveillance System Contract for Reconnaissance Vehicles
04/17/2026 | BUSINESS WIRETeledyne Technologies Incorporated announced that Teledyne FLIR Defense has been awarded a contract worth more than $35 million by WB Electronics S.A. (part of the WB Group) to equip reconnaissance vehicles with TacFLIR® 280-HDEP medium range multi-spectral surveillance systems.
The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.
Below the Surface: Looking Ahead to Where Integration Actually Happens
04/20/2026 | Chandra Gupta -- Column: Below the SurfaceProgress in RF rarely arrives and suddenly rewrites the rules. What actually moves performance forward almost always happens in the seams, the interfaces, the choices that determine whether individual parts are allowed to work together, or forced to fight one another. So, when we look ahead in RF systems—from DC through millimeter-wave—the most important conversations aren’t about isolated materials or heroic devices. They’re about integration, and more specifically, about how ceramic-based RF packages and module architectures shape system-level behavior long before the signal ever reaches free space.
Indium Showcases Solder Alloy Reliability Research for Heterogeneous Integration at ICEP-HBS
04/15/2026 | Indium CorporationIndium Corporation Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics Manufacturing Initiative (INEMI) project comparing SnBi and SAC305 solder alloys for first-level interconnects in complex heterogeneous packages.
Carbice Awarded Multi-Million Dollar U.S. Navy Contract for Thermal Assembly Joint Technology
04/14/2026 | PRNewswireCarbice, a U.S.-based manufacturer and supplier of novel multifunctional assembly joint technologies, has been awarded a multi-million dollar contract by the U.S. Navy's Office of Naval Research.