Aismalibar to Showcase Thermal Management Solutions for EV Battery Systems at The Battery Show North America 2024
September 27, 2024 | AismalibarEstimated reading time: 1 minute
Aismalibar, a leader in innovative thermal management materials, will be presenting its newest solutions for electric vehicle (EV) battery systems at The Battery Show North America from October 7-11, 2024. Located at Huntington Place, Detroit, MI, Aismalibar will exhibit at booth 6231, unveiling a range of cutting-edge Thermal Interface Materials (TIMs) designed to improve the safety, performance, and longevity of EV batteries.
- Thermal Interface Materials (TIMs): Aismalibar will introduce its new generation of high-performance TIMs, BOND SHEET CURED GLASS FREE, which provide outstanding thermal conductivity and durability, critical for the growing needs of high-power-density applications. These materials are designed to bridge gaps between heat-generating components and heatsinks, ensuring optimal heat dissipation in EV battery packs and other high-performance electronics.
- Thermal FR4 (CCLs): HTC 3.2w HIGH TG BOND SHEETS AND THIN LAM are used in PCB manufacturing to improve thermal management and reduce thermal vias. The use of Aismalibar's thermal FR4 can reduce the operating temperature of power components by up to 20%, which will result in improved output and extended lifespan.
- Insulated Metal Substrates (IMS): Aismalibar will also feature its latest IMS solutions, COBRITHERM ULTRATHIN 5W and 8W, designed for applications requiring both electrical insulation and efficient thermal conductivity. These substrates are ideal for power electronics, enabling manufacturers to manage higher power outputs without compromising system stability or lifespan.
Aismalibar invites attendees to booth 6231 to explore these groundbreaking thermal management solutions and learn more about how they can enhance the performance of EV batteries. Our team of experts will be available to discuss how Aismalibar’s innovations can support the evolving needs of the electric vehicle industry.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Indium to Feature Thermal Materials Solutions for High-Performance Computing at SC25
11/13/2025 | Indium CorporationAs one of the leading providers of high-performance thermal materials solutions, Indium Corporation® is proud to feature its lineup of metal thermal interface materials and other high-reliability products at The International Conference for High Performance Computing, Networking, Storage, and Analysis (SC25), taking place November 16-21, in St. Louis, Missouri.
Indium is Electrifying the Future with Advanced Materials Solutions at productronica
11/11/2025 | Indium CorporationAs one of the leading providers in advanced materials solutions for power device packaging and materials for the electronics assembly and solder industries, Indium Corporation® is proud to feature its lineup of high-reliability products at Productronica, taking place November 18-21, in Munich, Germany.
Alpha Insights, Performance by Design: Understanding Heat at the Core of Every Design
11/11/2025 | Team Alpha -- Column: Alpha Insights: Performance by DesignPower isn’t just about current. It’s about control. As electronic systems grow smaller and faster, every amp and every layer generates a new source of heat. That heat is more than a byproduct. It’s a measure of efficiency, a benchmark of performance, and often the first indication of failure.
Real Time with... SMTAI 2025: Enhancing Device Reliability With Innovative Materials from MacDermid Alpha Electronics Solutions
11/10/2025 | Real Time with...SMTAIMarcy LaRont speaks with Anna Lifton, MacDermid Alpha Electronics Solutions, who discusses the significance of reliability in devices through advanced materials. Anna highlights MacDermid Alpha's foray into polymer chemistry, showcasing new UV curing materials that address electrochemical reliability and thermal cycling challenges. The conversation also covers the difficulties hardware manufacturers encounter, particularly in thermal management and environmental compatibility.
Flex, LG Partner to Develop Advanced Thermal Management Solutions for Gigawatt Data Centers
11/07/2025 | FlexFlex, a global manufacturing leader and innovator in data center infrastructure solutions, announced a new partnership with LG Electronics (LG) to jointly develop integrated, modular cooling solutions that address the escalating thermal management challenges of AI-era data centers.