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Jabil Acquires Mikros Technologies

10/03/2024 | BUSINESS WIRE
Jabil Inc., a global leader in design, manufacturing, and supply chain solutions, announced the successful acquisition of Mikros Technologies LLC, a leader in the engineering and manufacturing of liquid cooling solutions for thermal management, completed October 1.

Indium to Showcase Industry-Leading Solder Paste and Alloy Technology at Detroit Battery Show

10/01/2024 | Indium Corporation
As one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its industry-leading Durafuse® solder technology at the Battery Show North America, October 7-10, in Detroit, Michigan.

Trouble in Your Tank: Interconnect Defect—The Three Degrees of Separation

10/01/2024 | Michael Carano -- Column: Trouble in Your Tank
It has been well documented that, with a very expensive and complex printed circuit board, thermal and mechanical excursions often find weaknesses. A lack of robustness and poor process control often leads to the exploitation of those weaknesses. An interconnect defect (ICD) often goes undetected until the printed circuit board reaches the final assembly stage or undergoes multiple thermal cycles, including interconnect stress tests or thermal shock. It is impossible to rework the ICD defect. But unlike voids, if detected in time, the panels can be reprocessed.

Rheinmetall, Honeywell Ink MoU to Develop New Technology

09/30/2024 | Rheinmetall
Düsseldorf-based technology group Rheinmetall and the U.S. industrials company Honeywell have signed a memorandum of understanding (MoU) to establish strategic cooperation in various fields of technology.

TSMC Expands Collaboration with Ansys by Integrating AI Technology to Accelerate 3D-IC Design

09/27/2024 | ANSYS
Ansys and TSMC have expanded their collaboration to leverage AI for advancing 3D-IC design and develop next generation multiphysics solutions for a wider array of advanced semiconductor technologies.
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