Camtek Introduced 5th Generation of the Eagle System Supporting Expected Growth In 2025

Estimated reading time: 1 minute

Camtek Ltd. is pleased to announce the launch of the latest leading inspection system, the Eagle Generation-5 (Eagle G5), marking a significant advancement in Camtek’s inspection and metrology technological capabilities. The new system offers unparalleled wafer throughput coupled with improved optical resolution, meeting both current market demand and customers’ future roadmap.

Camtek’s Eagle system is the advanced packaging standard solution for current and future 2D inspection and 3D metrology, targeted to applications such as HPC (high-performance computing), CIS (CMOS image sensors), SiC (Silicon Carbide), and others.  Camtek has already received orders for this system for 2025 deliveries.

Rafi Amit, Camtek’s CEO commented, “I am very excited about the launch of our fifth-generation Eagle platform. It pushes the boundaries of performance for inspection and metrology and I expect it to strengthen our dominant position in both the 2D inspection and 3D metrology in advanced packaging markets. This system is the first in a number of new products that we have been working on in recent years and will provide inspection and metrology solutions for the upcoming Advanced Packaging technologies that are characterized by fine pitch of micro bumps and hybrid bonding interconnects.

“The healthy demand in our end-markets, together with the initial contribution from our new products, underlies our expectations that 2025 will be another growth year for Camtek.”