Lockheed Martin, Altera Showcase Successful SWIFT Demo
September 30, 2024 | Lockheed MartinEstimated reading time: 1 minute

Lockheed Martin (NYSE: LMT) in collaboration with Altera, an Intel Company, completed a successful flight demonstration of our 12th Generation Electronic Warfare (Gen12) transceiver utilizing Altera’s Agilex™ 9 Direct RF FPGA (Multi-Chip Package, MCP-2).
The project, coined SWIFT (SHIP-enabled Wideband Transceiver Integrated Flight Test) by the Office of the Under Secretary of Defense for Research and Engineering (OUSD-R&E), established an aggressive requirement for Lockheed Martin to perform an electronic warfare flight demonstration utilizing Altera’s FPGA aboard a Group 2 Unmanned Air Vehicle (UAV) in less than 12 months.
Conducted at the U.S. Army’s Yuma Proving Ground, the SWIFT demonstration represented the first time Lockheed Martin used the Altera Direct RF FPGA in a government test environment, showcasing the device’s readiness to perform real-world missions. The event successfully proved the Gen12’s Electronic Support (ES) capability by performing the detect, identify and locate mission against real enemy emitters in a DoD relevant environment.
Through the success of this demonstration, Lockheed Martin and Altera proved how size, weight and power (SWaP) constrained airborne platforms can be utilized to deliver electronic warfare effects, while also allowing growth for new capabilities. The technology enables a low SWaP, Sensor Open System Architecture (SOSA) aligned digital transceiver that performs the Electronic Support (ES) and Electronic Attack (EA) missions using domestically produced semiconductors.
This demonstration serves as a proof point for the importance of OUSD-R&E State-of-the-Art Heterogeneous Integrated Packaging (SHIP) program and the ongoing need for sustainable U.S.-made microelectronics packages customized for DoD applications.
Suggested Items
Saab Receives Order for Ground-Based Air Defense from Sweden
07/01/2025 | SaabSaab has received an order from the Swedish Defense Materiel Administration (FMV) for the mobile short-range air defense solution RBS 70 NG with missiles.
High Density Packaging User Group (HDP) Welcomes Lincstech as New Member
07/01/2025 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.
Kitron Strengthens Order Backlog with EUR 11 Million Contract for Defense Communication
07/01/2025 | KitronKitron has received an order valued at EUR 11 million to produce advanced military communication products destined for the European market.
The Global Electronics Association Launches Industry Leading Circularity Resource Hub, Fast-Tracking Cost-Reducing, Efficient Solutions for Manufacturers
07/01/2025 | Global Electronics AssociationToday, the Global Electronics Association – the voice of the electronics industry – launched its Circularity Resource Hub. The Hub provides a centralized home for the latest industry standards, best practices, and resources to accelerate electronics’ sustainable and circular evolution.
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
07/01/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.