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Indium to Showcase Industry-Leading Solder Paste and Alloy Technology at Detroit Battery Show
October 1, 2024 | Indium CorporationEstimated reading time: 1 minute
As one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its industry-leading Durafuse® solder technology at the Battery Show North America, October 7-10, in Detroit, Michigan.
Indium Corporation will showcase the following among its featured products:
- Durafuse® LT is an award-winning solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature step soldering. It's ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and even outperforms SAC305 with optimal process setup.
- Durafuse® HR, based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
- Indalloy®301 LT Alloy for Preforms/InFORMS® is a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys.
Indium Corporation’s innovative solder and alloy technologies are designed to meet the stringent requirements of the electric vehicle market, where thermal management, reliability, and energy efficiency are paramount. The ability to enhance thermal cycling performance and reduce energy consumption aligns with the industry's drive towards sustainability and longer-lasting products. By offering advanced materials solutions like Durafuse® and Indalloy®, Indium Corporation helps automakers and battery manufacturers tackle the challenges of electrification and develop next-generation EV technologies.
To learn more about Indium Corporation’s solutions, visit our experts at the Detroit Battery Show in hall A-C, booth #733.
Suggested Items
Some Fundamentals of Tin-Bismuth Metallurgy and Electromigration
09/24/2024 | Prabjit Singh, Raiyo Aspandiar, Haley Fu, and L. A. SwaminathanNear-eutectic tin-bismuth alloy is a strong contender as the solder of choice for low-temperature electronic assembly applications. This article will describe the recent significant developments by the iNEMI project team on the understanding of the electromigration behavior of Sn-Bi solder which has a unique physical metallurgy and electromigration behavior quite different for that of Sn-Ag-Cu (SAC) solder and other solders in common use today.
iNEMI Packaging Tech Topic Webinar: Packaging Interconnect Material Technology Series
09/19/2024 | iNEMIThe International Electronics Manufacturing Initiative (iNEMI) continues its Packaging Interconnect Material Technology Series with a webinar on Transient Liquid Phase (TLP) Bonding for High-Temperature Soldering Processes.
The Knowledge Base: The Pivotal Role of Solder Paste
09/16/2024 | Mike Konrad -- Column: The Knowledge BaseIn the complex world of electronics manufacturing, the humble solder paste plays a pivotal role. Often overshadowed by more conspicuous electronics assembly equipment and materials, this blend of powdered metal and flux is the unsung hero that binds the electronic circuits together. But beyond its adhesive and conductive properties, the selection of the right solder paste is crucial for ensuring the long-term reliability of electronic devices.
Indium to Showcase Durafuse Solder Technology at Productronica India
09/02/2024 | Indium CorporationAs one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its innovative Durafuse® solder technology at Productronica India, September 11-13, in Delhi, India.
Indium Technical Manager to Present on Solder Solutions for Cutting-Edge Solutions for AI and Automotive at SEMICON Taiwan
08/26/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager Jason Chou will present on the timely topics of AI and EV technology at SEMICON Taiwan on September 5 in Taipei,Taiwan. Chou’s presentation will highlight cutting-edge, high-reliability, and low-temperature solder solutions for these rapidly evolving markets.