Dan’s Biz Bookshelf: ‘Believe in Better'
The Big Picture: Our Big ‘Why’ in the Age of AI
The Chemical Connection: Through-glass Vias in Glass Substrates
Advancements in High-reliability Alloys for Automotive and High-performance Applications
May 22, 2025 | Barry Matties, I-Connect007Estimated reading time: 1 minute
At IPC APEX EXPO, MacDermid Alpha Electronic Solutions showcased its latest innovations in SMT assembly materials designed to meet the growing demands for reliability and sustainability in automotive and high-performance applications. In this interview, Ebad Rehman, business product manager, discusses the evolution of high-reliability alloys, spotlighting ALPHA® Innolot®, a proven solution developed in response to the automotive industry’s increasing expectations for durability and performance under harsh operating conditions.
He also introduces a new reworkable edgebond that supports sustainability goals by enabling component reworkability, improving manufacturing yields, and minimizing scrap, making it ideal for critical automotive applications requiring exceptional board-level reliability. Additionally, Beth Turner, senior technical manager for Electrolube, shares insights into the development of conformal coatings and thermal interface materials, emphasizing their role in enhancing PCB reliability and performance in harsh environments.
Barry Matties: Ebad, it is good to speak with you. Why don’t we start with a general overview of your product lines?
Ebad Rehman: My product line is primarily focused on high-reliability solutions and materials for SMT applications, including edgebond, underfills, Innolot, and the future generation of high-reliability alloys. These products are focused on ultra-high-density interconnects (UHDI) and next-generation electronics assemblies in automotive, aerospace, and high-performance computing markets. Recently, we introduced our newest HiTech®, which contributes to sustainability and provides flexibility.
Matties: What problem are you trying to solve when looking at the reliability products?
Rehman: When we look at reliability, it's a continuum. In the early 2000s, the first lead-free high-reliability alloy was introduced. MacDermid Alpha was part of the consortium that led to the advent of Innolot, which is now synonymous with higher reliability alloys. That continuum means we’re always evolving our solutions—what worked five years ago simply won’t meet the demands of today’s electronics.
As we look at trends, we are especially driven by the automotive market segment, where in-use longevity and time-to-failure are critical. These are mission-critical applications fuel that reliability continuum: each new generation of electronics tests the limits of existing materials, so we must continuously push performance higher.
To read this entire In-depth with... MacDermid Alpha Electronics Solutions interview which appears in the May 2025 issue of Design007 Magazine, click here.
Share on:
Suggested Items
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.
The Death of the Microsection
06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.
Marcy's Musings: The Hole Truth—Via Integrity in an HDI World
06/17/2025 | Marcy LaRont -- Column: Marcy's MusingsThis month, we’re talking about “the hole truth,” namely, via reliability in an HDI world. As I contemplated what it takes to get the “perfect” via, it got me thinking about what it takes to create the “perfect” magazine issue.
Advint Delivers Advanced Electroplating Training to Triangle Labs
06/02/2025 | Advint IncorporatedDuring the last week of April, Advint Incorporated conducted a comprehensive two-day on-site electroplating training session for the technical team at Triangle Labs, Inc., a key innovator in the printed circuit board space. The training was structured to align with the demands of high-reliability plating processes suitable for RF and high-frequency substrates.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.