Marcy’s Musings: The Legislative Outlook—Helping or Hurting?
It’s Only Common Sense: The Phone Is Still Mightier Than the Keyboard
The Marketing Minute: Marketing With Layers
Advancements in High-reliability Alloys for Automotive and High-performance Applications
May 22, 2025 | Barry Matties, I-Connect007Estimated reading time: 1 minute
At IPC APEX EXPO, MacDermid Alpha Electronic Solutions showcased its latest innovations in SMT assembly materials designed to meet the growing demands for reliability and sustainability in automotive and high-performance applications. In this interview, Ebad Rehman, business product manager, discusses the evolution of high-reliability alloys, spotlighting ALPHA® Innolot®, a proven solution developed in response to the automotive industry’s increasing expectations for durability and performance under harsh operating conditions.
He also introduces a new reworkable edgebond that supports sustainability goals by enabling component reworkability, improving manufacturing yields, and minimizing scrap, making it ideal for critical automotive applications requiring exceptional board-level reliability. Additionally, Beth Turner, senior technical manager for Electrolube, shares insights into the development of conformal coatings and thermal interface materials, emphasizing their role in enhancing PCB reliability and performance in harsh environments.
Barry Matties: Ebad, it is good to speak with you. Why don’t we start with a general overview of your product lines?
Ebad Rehman: My product line is primarily focused on high-reliability solutions and materials for SMT applications, including edgebond, underfills, Innolot, and the future generation of high-reliability alloys. These products are focused on ultra-high-density interconnects (UHDI) and next-generation electronics assemblies in automotive, aerospace, and high-performance computing markets. Recently, we introduced our newest HiTech®, which contributes to sustainability and provides flexibility.
Matties: What problem are you trying to solve when looking at the reliability products?
Rehman: When we look at reliability, it's a continuum. In the early 2000s, the first lead-free high-reliability alloy was introduced. MacDermid Alpha was part of the consortium that led to the advent of Innolot, which is now synonymous with higher reliability alloys. That continuum means we’re always evolving our solutions—what worked five years ago simply won’t meet the demands of today’s electronics.
As we look at trends, we are especially driven by the automotive market segment, where in-use longevity and time-to-failure are critical. These are mission-critical applications fuel that reliability continuum: each new generation of electronics tests the limits of existing materials, so we must continuously push performance higher.
To read this entire In-depth with... MacDermid Alpha Electronics Solutions interview which appears in the May 2025 issue of Design007 Magazine, click here.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
American Standard Circuits Achieves Successful AS9100 Recertification
10/14/2025 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading manufacturer of advanced printed circuit boards, proudly announces the successful completion of its AS9100 recertification audit. This milestone reaffirms ASC’s ongoing commitment to the highest levels of quality, reliability, and process control required to serve aerospace, defense, space, and other mission-critical industries.
SEL Showcases Global Factories and Product Development Journey for Manufacturing Day
10/10/2025 | SELSEL is celebrating Manufacturing Day 2025 with the release of a new video showcasing its product development and vertically integrated manufacturing process.
Dymax to Address Key Electronics Assembly Challenges with Light-Cure Solutions at SMTA International 2025
10/09/2025 | DymaxDymax, a global manufacturer of light-curing materials and equipment, will exhibit at SMTA International 2025 in Rosemont, Illinois, October 21–23. Visit booth 2834 to see how Dymax technologies protect components from harsh environments, help meet regulatory requirements, and streamline assembly.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.