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Some Fundamentals of Tin-Bismuth Metallurgy and Electromigration 

09/24/2024 | Prabjit Singh, Raiyo Aspandiar, Haley Fu, and L. A. Swaminathan
Near-eutectic tin-bismuth alloy is a strong contender as the solder of choice for low-temperature electronic assembly applications. This article will describe the recent significant developments by the iNEMI project team on the understanding of the electromigration behavior of Sn-Bi solder which has a unique physical metallurgy and electromigration behavior quite different for that of Sn-Ag-Cu (SAC) solder and other solders in common use today.

iNEMI Packaging Tech Topic Webinar: Packaging Interconnect Material Technology Series

09/19/2024 | iNEMI
The International Electronics Manufacturing Initiative (iNEMI) continues its Packaging Interconnect Material Technology Series with a webinar on Transient Liquid Phase (TLP) Bonding for High-Temperature Soldering Processes.

The Knowledge Base: The Pivotal Role of Solder Paste

09/16/2024 | Mike Konrad -- Column: The Knowledge Base
In the complex world of electronics manufacturing, the humble solder paste plays a pivotal role. Often overshadowed by more conspicuous electronics assembly equipment and materials, this blend of powdered metal and flux is the unsung hero that binds the electronic circuits together. But beyond its adhesive and conductive properties, the selection of the right solder paste is crucial for ensuring the long-term reliability of electronic devices.

Indium to Showcase Durafuse Solder Technology at Productronica India

09/02/2024 | Indium Corporation
As one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its innovative Durafuse® solder technology at Productronica India, September 11-13, in Delhi, India.

Indium Technical Manager to Present on Solder Solutions for Cutting-Edge Solutions for AI and Automotive at SEMICON Taiwan

08/26/2024 | Indium Corporation
Indium Corporation Senior Area Technical Manager Jason Chou will present on the timely topics of AI and EV technology at SEMICON Taiwan on September 5 in Taipei,Taiwan. Chou’s presentation will highlight cutting-edge, high-reliability, and low-temperature solder solutions for these rapidly evolving markets.
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