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Indium Wins EM Asia Innovation Award
May 1, 2025 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.
Established in 2006, the EM Asia Innovation Award program recognizes and celebrates excellence in the Asian electronics industry, encouraging companies to achieve the highest standards and push the industry forward. The awards are based on strict criteria, including innovativeness, cost effectiveness, and technology advancement.
“We’re always honored to be recognized by industry peers for our innovative advances in materials science,” said Indium Corporation President and CEO Ross Berntson. “Our dedicated team of engineers developed Durafuse® HR in close collaboration with our customers in the semiconductor and e-Mobility industries, among others, identifying inventive ways to address many of their electronics assembly needs and challenges.”
Durafuse® HR is a high-reliability solder alloy developed from the company’s Durafuse® mixed-alloy technology. Engineered to deliver enhanced thermal cycling performance and superior voiding performance without vacuum reflow, Durafuse® HR is designed specifically for the rigorous demands of automotive electronics and other high-reliability applications. It is ideal for manufacturers transitioning from SAC305, requiring only minimal process adjustments for easy implementation.
Among its key features, Durafuse® HR offers:
- Exceptional thermal cycling reliability, withstanding 3,000+ cycles at -40°C–125°C
- Reduced bottom-terminated component (BTC) voiding, even without vacuum reflow
- Superior shear strength for increased durability and reduced solder joint cracking
- Seamless compatibility with SAC305 reflow profiles and common PCB surface finishes (ImSn, OSP, ENIG)
- Optimized yield rates and reliability, reducing defects, rework, and overall production costs
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Indium Expert to Present on Advancements in Bi-free In-containing Lower-Temperature Solder at ICEE 2025
12/11/2025 | Indium CorporationIndium Corporation’s Senior R&D Manager of the Alloy Group, Hongwen Zhang, Ph.D., will present on the company’s award-winning Durafuse® Technology during the IEEE International Conference on Emerging Electronics (ICEE), December 13–16, in Bengaluru, India.
Indium is Electrifying the Future with Advanced Materials Solutions at productronica
11/11/2025 | Indium CorporationAs one of the leading providers in advanced materials solutions for power device packaging and materials for the electronics assembly and solder industries, Indium Corporation® is proud to feature its lineup of high-reliability products at Productronica, taking place November 18-21, in Munich, Germany.
Indium to Showcase Durafuse Solder Technology at NEPCON Japan
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Indium to Showcase Industry-Leading Solder Paste and Alloy Technology at Detroit Battery Show
10/01/2024 | Indium CorporationAs one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its industry-leading Durafuse® solder technology at the Battery Show North America, October 7-10, in Detroit, Michigan.
Indium Corporation Introduces Cutting-Edge, High-Reliability Alloy for Solder Paste
06/14/2024 | Indium CorporationIndium Corporation is proud to introduce Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse mixed-alloy technology.