Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
AIM to Present on Ultra-Miniature Component Assembly at SMT-Info
October 2, 2024 | AIMEstimated reading time: 1 minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMT-Info Technical Conference taking place October 15-16 in Brno, Czech Republic. AIM’s Ales Sedlak will be giving a presentation titled “Addressing Concerns of Ultra-Miniature Component Assembly: M0201, 008005, and Micro/MiniLEDs.”
Presentation abstract: The use of ultra-miniature components is driven by the demand for increased functionality in electronic devices. SMT components such as 008004/M0201 are being used in consumer and automotive applications today. Similarly, MiniLED components are finding their way into displays available in the market. Manufacturers are creating new PCB designs, using novel assembly techniques, and introducing innovative materials to overcome the unique challenges faced when implementing these components. This presentation will discuss the new information on how to overcome the challenges faced in ultra-miniature component assembly and address the needs of emerging markets.
Among other great products, AIM will also be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste at this event. AIM’s NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.
To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at SMT-Info October 15-16.
Share on:
Suggested Items
I-Connect007’s Editor’s Choice: Five Must-Reads for the Week
07/04/2025 | Marcy LaRont, I-Connect007For our industry, we have seen several bullish market announcements over the past few weeks, including one this week by IDC on the massive growth in the global server market. We’re also closely watching global trade and nearshoring. One good example of successful nearshoring is Rehm Thermal Systems, which celebrates its 10th anniversary in Mexico and the official opening of its new building in Guadalajara.
Count On Tools Recognizes Donna Orr’s Ongoing Leadership and Impact Across 27+ Years
06/26/2025 | Count On ToolsCount On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, is proud to recognize Donna Orr, Executive Manager, for her continued dedication and leadership as she marks more than 27 years with the company.
A Record Year for the 75th Annual IEEE Electronic Components and Technology Conference (ECTC)
06/26/2025 | ECTCThe 75th annual 2025 IEEE Electronic Components and Technology Conference (ECTC), held at the Gaylord Texan Resort & Convention Center here May 27-30, had record attendance, a record number of paper submissions/presentations, record international and student participation, and a record number of exhibitors in a sold-out exhibition hall:
The Death of the Microsection
06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.
Specially Developed for Laser Plastic Welding from LPKF
06/25/2025 | LPKFLPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.