The Right Approach: Get Ready for ISO 9001 Version 6
Dan’s Biz Bookshelf: ‘Still Broke: Walmart’s Remarkable Transformation'
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024
October 2, 2024 | SEMIEstimated reading time: 1 minute
Powered by strong semiconductor demand across diverse end applications, the global semiconductor packaging materials market is expected to start a growth cycle with a 5.6% compound annual growth rate (CAGR) projected through 2028, SEMI, TECHCET and TechSearch International announced in their latest Global Semiconductor Packaging Materials Outlook (GSPMO) report. The report highlights AI as an expected growth driver for advanced packaging applications, despite currently low unit volumes due to the newness of the market segment.
The GSPMO report provides comprehensive data and forecasts for substrates, leadframes, bonding wire, and additional advanced packaging materials.
“After a challenging 2023, which saw a 15.5% decline in the semiconductor packaging materials market, our latest report forecasts a return to growth in 2024,” said Lita Shon-Roy, TECHCET President and CEO. “The global packaging materials market is expected to exceed $26 billion by 2025 and continue solid growth through 2028.”
Global packaging materials
“Substrates account for a large portion of the revenue for the packaging materials market, and within the category, FC-BGA substrates make up the majority of the revenue growth,” said Jan Vardaman, President of TechSearch International. “The CAGR for flip chip BGA/LGA revenue is expected to be 7.6% from 2023 to 2028. Other key growth areas include wafer-level packaging (WLP) dielectrics and flip chip underfill. The laminate substrates segment is expected to grow 7.3% annually in volume, while leadframes and bonding wire are also forecasted to recover, growing by 5.0% and 6.4%, respectively.”
The GSPMO 2024 report is designed to help companies capitalize on emerging trends, navigate supply chain challenges, and make informed decisions in sourcing high-performance materials.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
U.S. CHIPS Act Funding Detailed on SIA Website
09/12/2025 | Nolan Johnson, I-Connect007The U.S. CHIPS Act has moved well into the implementation stage in 2025. But where has that money gone? The Semiconductor Industry Association has been tracking these projects and provides details on its website. It was updated May. Among the five key programs being managed under CHIPS, two stand out as influencing advanced electronic packaging: the National Advanced Packaging Manufacturing Program (NAPMP), and the CHIPS Manufacturing USA Institute (MFG USA).
ASMPT Announces Gordon Lam as Chief Commercial Officer for SEMI Solutions
09/08/2025 | ASMPTASMPT, the world's leading provider of integrated hardware and software solutions for semiconductor and electronics manufacturing, announced the appointment of Mr. Gordon Lam as Chief Commercial Officer for Semiconductor Solutions (SEMI Solutions).
Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
09/02/2025 | Dennis Fritz -- Column: Defense Speak InterpretedIn my May column, I examined the topic of the CHIPS Act and its current status as a U.S. government program. I found that CHIPS activities continue, but some corporations have delayed or canceled them because of budget cuts or corporation-specific problems. However, CHIPS integrated circuits—mostly administered by the Department of Commerce—don’t fully drive the electronics interconnection activity being funded by the government. Let’s cover the progress/status of other programs:
Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility
09/01/2025 | BUSINESS WIREAmkor Technology, Inc., a leading provider of semiconductor packaging and test services, announced revised plans for the location of the company’s new semiconductor advanced packaging and test facility in Arizona.
Koh Young Hosts First Technical Review Meeting at New Taiwan Office to Showcase Advanced Metrology and Inspection Solutions
09/01/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, is inviting semiconductor and SMT professionals to its first Technical Review Meeting at the newly opened Koh Young Taiwan (KYTW) office in Zhubei City.