It’s Only Common Sense: Be the Solution, Not the Problem
American Made Advocacy: Long-time Challenges Confront a New Administration
Marcy's Musings: It's Show Time!
Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024
October 2, 2024 | SEMIEstimated reading time: 1 minute
Powered by strong semiconductor demand across diverse end applications, the global semiconductor packaging materials market is expected to start a growth cycle with a 5.6% compound annual growth rate (CAGR) projected through 2028, SEMI, TECHCET and TechSearch International announced in their latest Global Semiconductor Packaging Materials Outlook (GSPMO) report. The report highlights AI as an expected growth driver for advanced packaging applications, despite currently low unit volumes due to the newness of the market segment.
The GSPMO report provides comprehensive data and forecasts for substrates, leadframes, bonding wire, and additional advanced packaging materials.
“After a challenging 2023, which saw a 15.5% decline in the semiconductor packaging materials market, our latest report forecasts a return to growth in 2024,” said Lita Shon-Roy, TECHCET President and CEO. “The global packaging materials market is expected to exceed $26 billion by 2025 and continue solid growth through 2028.”
Global packaging materials
“Substrates account for a large portion of the revenue for the packaging materials market, and within the category, FC-BGA substrates make up the majority of the revenue growth,” said Jan Vardaman, President of TechSearch International. “The CAGR for flip chip BGA/LGA revenue is expected to be 7.6% from 2023 to 2028. Other key growth areas include wafer-level packaging (WLP) dielectrics and flip chip underfill. The laminate substrates segment is expected to grow 7.3% annually in volume, while leadframes and bonding wire are also forecasted to recover, growing by 5.0% and 6.4%, respectively.”
The GSPMO 2024 report is designed to help companies capitalize on emerging trends, navigate supply chain challenges, and make informed decisions in sourcing high-performance materials.
Share on:
Suggested Items
IMAPS and DPC: 21 Years of Elevating Technical Knowledge
03/13/2025 | Marcy LaRont, I-Connect007The IMAPS 21st Device Packaging Conference (DPC) may have taken place at a conference center located down an idyllic desert road showcasing the best of what native Arizona has to offer, but the topics at this conference were anything but laid-back. This important platform for professionals in microelectronics and advanced packaging set the stage for a technology in high demand. Brian Schieman, IMAPS executive director, says the show was organized to demonstrate their commitment to addressing current technological trends and with significant energy directed toward fostering connections within the supply chain.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
03/07/2025 | Andy Shaughnessy, I-Connect007It’s been a busy week. My must-reads include articles and news items on global trends and challenges, groundbreaking technology, the hunt for the elusive young PCB designers, and some personnel changes. We also have a great column on the value of following up and keeping promises. We’re all guilty of “dropping the ball” from time to time, aren’t we?
IMAPS’ Annual Conference Opener in Phoenix ‘Blew My Mind’
03/05/2025 | Marcy LaRont, I-Connect007It was a cool and sunny morning as I headed out to the IMAPS Device Packaging Conference 2025 in Arizona early Tuesday, which featured two compelling keynote speakers, and a day chocked full of technical sessions. IMAPS 2025 also hosted a sold-out exhibit hall with 65 exhibitors from IBM and Heraeus to Cadence and KYZEN, to name just a few. The technology and packaging discussions at this conference blew my mind last year, and it is clear this year would be no different.
2025 IEEE Electronic Components and Technology Conference
03/04/2025 | IEEEMore than 2,000 scientists, engineers and businesspeople are expected to attend the 75th annual IEEE Electronic Components and Technology Conference (ECTC) from May 27-30, 2025 at the Gaylord Texan Resort & Convention Center here.
Ennostar Consolidates Resources to Drive High-Value Optical Semiconductors Applications in 3+1 Key Areas
02/25/2025 | TrendForceIn an effort to optimize its organizational structure and accelerate its optical semiconductors business, Ennostar announced on February 21st, 2025, the merger of its subsidiaries—Epistar and Lextar Electronics—under the unified brand of Ennostar Corporation.