American Made Advocacy: How Congress Can Restore the U.S. Printed Circuit Board Industry
Defense Speak Interpreted: Weapons—Electrical Power vs. Energetics
The Government Circuit: USMCA Review—A Crucial Opportunity to Fortify North American Electronics
Department of Defense Awards $30 Million to Expand Domestic Printed Circuit Board and Substrate Production
October 1, 2024 | Department of DefenseEstimated reading time: 1 minute
The Department of Defense announced today a $30 million award to TTM Technologies Inc. (TTM) in Santa Ana, California. This award, facilitated through the Defense Production Act Purchases (DPAP) office, will enable TTM to acquire and install advanced manufacturing equipment and develop prototype designs for printed circuit boards. The project will commence at TTM's Centers of Excellence across the United States, ultimately culminating in integration into its new Syracuse, New York facility. This strategic initiative aims to enhance TTM's capabilities and enable the timely delivery of cutting-edge technology to support vital defense programs.
"The DoD requires state-of-the-art advanced printed circuit board manufacturing capability to support defense programs," said Dr. Laura Taylor-Kale, Assistant Secretary of Defense for Industrial Base Policy (ASD(IBP)). "This project provides domestic manufacturing capabilities to meet demand for current and future U.S. systems."
"This $30 million investment will help enable TTM to build a new 200,000+ square foot facility, significantly increasing domestic production of ultra-high density printed circuit boards and bolstering supply chain resilience in line with the 2024 National Defense Industrial Strategy," added Mr. Anthony Di Stasio, Director of the Manufacturing Capability Expansion and Investment Prioritization (MCEIP) directorate within OASD(IBP).
This was the 70th award the DPAP program issued across multiple areas in Fiscal Year 2024, for a total value of $672 million. The DPAP office is overseen by the MCEIP directorate.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
SARGAD, Telangana Sign $100M Aerospace & Defense MOU
01/20/2026 | PRNewswireAt the World Economic Forum today, SARGAD LLC and the Government of Telangana signed a Memorandum of Understanding to establish AeroNxt, a collaborative initiative to modernize India's aerospace and defense manufacturing ecosystem.
USPAE Grants ‘Greater Access’ to Defense Electronics Manufacturers
01/20/2026 | Nolan Johnson, I-Connect007Chris Peters, co-founder of the U.S. Partnership for Assured Electronics and expert on manufacturing supply chains, recently announced he would be stepping back from his role. I first met Chris in the spring of 2020, when SMT007 Magazine interviewed him for the July 2020 issue. I was pleased that Chris took the time to reflect on the USPAE, past present and future, and his optimism is infectious.
Northrop Grumman Launches Redesigned ICBM Target
01/19/2026 | Northrop GrummanNorthrop Grumman Corporation successfully launched its redesigned Intercontinental Ballistic Missile (ICBM) target vehicle for the first time, demonstrating a new capability for missile defense flight test missions.
Teledyne FLIR Wins $32M Recon Surveillance Contract in Bulgaria
01/15/2026 | BUSINESS WIRETeledyne FLIR Defense, part of Teledyne Technologies Incorporated, announced that it has been awarded a contract by the U.S. Army worth up to $32 million to deliver and integrate advanced electro-optical (EO/IR) systems for the Stryker Infantry Carrier Vehicle (ICV) Recon Kit.
Vertical Aerospace Strengthens Leadership Team with Powertrain, Data and People Appointments
01/08/2026 | BUSINESS WIREVertical Aerospace, a global aerospace and technology company pioneering electric aviation, today announced the appointments of Ollie Roberts as Chief People Officer (CPO), Juan Carlos Sacristan as Chief Data & Information Officer (CDIO), and Richard Moore as Vice President, Powertrain.