-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
BrainChip Introduces Lowest-Power AI Acceleration Co-Processor
October 2, 2024 | BUSINESS WIREEstimated reading time: 2 minutes
BrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, event-based, brain-inspired AI, today introduced the Akida™ Pico, the lowest power acceleration co-processor that enables the creation of very compact, ultra-low power, portable and intelligent devices for wearable and sensor integrated AI into consumer, healthcare, IoT, defense and wake-up applications.
Akida Pico accelerates limited use case-specific neural network models to create an ultra-energy efficient, purely digital architecture. Akida Pico enables secure personalization for applications including voice wake detection, keyword spotting, speech noise reduction, audio enhancement, presence detection, personal voice assistant, automatic doorbell, wearable AI, appliance voice interfaces and more.
The latest innovation from BrainChip is built on the Akida2 event-based computing platform configuration engine, which can execute with power suitable for battery-powered operation of less than a single milliwatt. Akida Pico provides power-efficient footprint for waking up microcontrollers or larger system processors, with a neural network to filter out false alarms to preserve power consumption until an event is detected. It is ideally suited for sensor hubs or systems that need to be monitored continuously using only battery power with occasional need for additional processing from a host.
BrainChip’s exclusive MetaTF™ software flow enables developers to compile and optimize their specific Temporal-Enabled Neural Networks (TENNs) on the Akida Pico. With MetaTF’s support for models created with TensorFlow/Keras and Pytorch, users avoid needing to learn a new machine language framework while rapidly developing and deploying AI applications for the Edge.
Among the benefits of Akida Pico are:
- Ultra-low power standalone NPU core (<1mW)
- Support power islands for minimal standby power
- Industry-standard development environment
- Very Small logic die area
- Optimize overall die size with configurable data buffer and model parameter memory
“Like all of our Edge AI enablement platforms, Akida Pico was developed to further push the limits of AI on-chip compute with low latency and low power required of neural applications,” said Sean Hehir, CEO at BrainChip. “Whether you have limited AI expertise or are an expert at developing AI models and applications, Akida Pico and the Akida Development Platform provides users with the ability to create, train and test the most power and memory efficient temporal-event based neural networks quicker and more reliably.”
BrainChip’s Akida is an event-based compute platform ideal for early detection, low-latency solutions without massive compute resources for robotics, drones, automotive and traditional sense-detect-classify-track solutions. BrainChip provides a range of software, hardware and IP products that can be integrated into existing and future designs, with a roadmap for customers to deploy multi-modal AI models at the edge.
Suggested Items
GB200 Rack Supply Chain Requires Further Optimization, Peak Shipments Expected Between 2Q25 and 3Q25
12/18/2024 | TrendForceAs the market closely follows the progress of NVIDIA’s GB200 rack-mounted solution, TrendForce’s latest research indicates that the supply chain requires additional time for optimization and adjustment.
ROHM’s PMICs for SoCs have been Adopted in Reference Designs for Telechips’ Next-Generation Cockpits
12/13/2024 | ROHMROHM has announced the adoption of its PMICs in power reference designs focused on the next-generation cockpit SoCs ‘Dolphin3’ (REF67003) and ‘Dolphin5’ (REF67005) by Telechips, a major fabless semiconductor manufacturer for automotive applications headquartered in Pangyo, South Korea.
onsemi Acquires Silicon Carbide JFET Technology to Enhance Its Power Portfolio for AI Data Centers
12/13/2024 | onsemionsemi announced that it has entered into an agreement to acquire the Silicon Carbide Junction Field-Effect Transistor (SiC JFET) technology business, including the United Silicon Carbide subsidiary, from Qorvo for $115 million in cash.
TTM Technologies Introduces Innovative Radio Frequency Components for Telecom Band n104 to Enhance 5.5G Applications
12/12/2024 | Globe NewswireTTM Technologies, Inc. has expanded its Radio Frequency and Specialty Components (RF&S) product offering by releasing a family of components supporting telecom band n104, an emerging band extension for 5.5G applications.
Saki Introduces Advanced X-Ray Inspection System for Next-Generation Miniaturized and Slim Power Modules
12/11/2024 | Saki Corp.Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce the launch of the 3Xi-M200v3, the latest addition to its acclaimed 3Xi-M200 AXI series.