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Advanced Electronics Packaging Digest

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Nordson EFD to Preview New Dispensing Technologies for Medical Device Assembly at COMPAMED 2026

11/06/2026 | Nordson
Nordson EFD, a Nordson company, announced that trade show attendees will get the first look at two new dispensing technologies, the Ultimus AccuFlow™ and PICO Pµlse® XP HV, at COMPAMED 2026, November 16–19 at the Düsseldorf Exhibition Centre in Düsseldorf, Germany.

IPC K-FEST 2026 Brings AI, Manufacturing and Standards into Focus

11/06/2026 | Global Electronics Association
Organized by the Global Electronics Association with support from Korea Testing Laboratory (KTL), the fourth IPC Korea Festival of Electronics Standards and Technology (IPC K-FEST 2026) took place in Seoul on November 3.

Department of War Announces $150 Million in Awards to Multidisciplinary University Research Teams

11/03/2026 | U.S. Department of War
The Department of War announced $150 million in awards for basic defense-related research projects as part of the Multidisciplinary University Research Initiative (MURI).

Columbia, MIT Professors Honored for Semiconductor Research

10/29/2026 | SIA
SIA and SRC present the University Research Awards annually to professors who demonstrate excellence in advancing research in semiconductor technology and design.

Cetec ERP 5.0 Launches in Beta with Configurable Dashboards, Live List Screens and Redesigned Interface

10/28/2026 | Cetec ERP
Cetec ERP, a full-suite ERP platform provider, opened the beta of Cetec ERP 5.0, a major update to its web-native manufacturing ERP built around easier access to data and more intuitive daily workflows. 
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