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Biden-Harris Administration Announces CHIPS Incentives Award with Samsung Electronics to Solidify U.S. Leadership in Leading-Edge Semiconductor Production

12/23/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded Samsung Electronics (Samsung) up to $4.745 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication facilities.

SIA Praises Finalization of CHIPS Incentives to Supplement SK Hynix’s $3.87 Billion Investment in Indiana

12/20/2024 | SIA
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending finalization of CHIPS and Science Act manufacturing investments announced by the U.S. Department of Commerce and SK hynix. The incentives will supplement the company’s $3.87 billion investment in Indiana for advanced packaging operations and R&D.

RTX's Raytheon and Ursa Major Conduct Successful Flight Test

12/20/2024 | RTX
Raytheon, an RTX business, and Ursa Major announced its advanced long-range solid rocket motor completed a successful missile flight test for the U.S. Army. The companies' combined experience and expertise in digital engineering was a critical factor in accelerating the design and development of this transformational capability.

ViTrox Welcomes Gemaddis as a New Sales Channel Partner in France

12/20/2024 | ViTrox
ViTrox Technologies, which aims to be the World’s Most Trusted Technology Company in delivering innovative, advanced, and cost-effective automated Machine Vision Inspection Solutions for the semiconductor and electronics manufacturing industries, is honoured to announce its partnership with Gemaddis as its new Sales Channel Partner (SCP) for the French market, effective May 2024.

The Effects of Copper on a Transmission Line

12/23/2024 | Todd Kolmodin, Gardien Services
As technology advances, our substrates become increasingly smaller, and chip technology has progressed to where HDI and UHDI are household terms. Ten years ago, this new design architecture would strike fear in the hearts of any plating engineer. Unfortunately, North American and European manufacturing has lagged due to excessive offshoring of commercial and some high-reliability product lines. Fortunately, most of the military and aerospace product has remained controlled. But in doing so, the designs utilized by the mil/aero and medical sectors’ reliability lines were corralled into the manufacturing capabilities of the North American and European providers.
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