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A Practical Approach to Material Selection for High Power PCBs

08/13/2026 | Drew Delaney, Isola Group
With AI server architectures demanding high-power converter solutions to improve power efficiency and affordability, PCB design can challenge engineers who treat material selection as a single-variable problem. Pick a laminate for thermal conductivity, and you may experience a CTE mismatch that cracks vias after 50 thermal cycles. Optimize for dielectric loss, and you might sacrifice the isolation margin your certification depends on. High-power boards require consideration of multiple variables, including electrical, thermal, mechanical, reliability, and manufacturability, which cannot be optimized alone.

Remtec to Participate at PCB West 2026, Showcasing Advanced Ceramic PCB Technologies for High-Reliability Electronics

08/04/2026 | Remtec
Remtec President & CEO Brian Buyea invites Engineers, Designers and OEMs to discover the future of advanced ceramic circuit solutions.

Vishay Intertechnology TSOP15300 Series IR Receivers Support All Major Remote Control Codes

08/04/2026 | Globe Newswire
Vishay Intertechnology, Inc. introduced a new series of infrared (IR) receiver modules for IR remote control applications.

Dymax Launches 9310 Adhesive for High-Reliability PCB Reinforcement

07/30/2026 | Dymax
Dymax, a global manufacturer of light-curing materials and equipment, announces the launch of its 9310 adhesive engineered to reinforce fine-pitch, leadless components on printed circuit boards.

Global Electronics Association Releases IPC-A-630A for Electronic Box Assemblies

07/29/2026 | Global Electronics Association
Updated standard provides class-coded acceptance criteria for box build and electromechanical assembly, from enclosure fabrication to final system testing.
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