Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Ventec Promotes Bill Wang to Group Technical Vice President
October 14, 2024 | VentecEstimated reading time: 1 minute
Ventec International Group, a Taiwan Stock Exchange listed global supplier of advanced base materials for the PCB industry worldwide, has promoted Bill Wang to Group Technical Vice President.
Having served as Ventec’s Technical Director since 2013, Bill now adds responsibility for the group’s overseas business units to his remit, leveraging the company’s wide-ranging expertise to create solutions in sectors such as high-performance computing, cloud servers, communications and networking, cellular infrastructure, consumer products, and solid-state lighting. He will continue to lead the Technical Department at the company’s global headquarters, while also directing the Global OEM Technology and IMS Technology sections in the EMEA and Americas regions.
Welcoming him in his new role, Jason Chung, Ventec International Group CEO, said, “Bill’s energy has driven our technical department to ever-greater achievements and our current pre-eminent position in substrate materials that deliver cutting-edge performance. He richly deserves the extra faith we are placing in him, and I have every confidence he will continue to expand our capabilities and strengthen our leading position.”
Bill commented, “Ventec’s technical prowess, alongside our supply-chain capabilities and global customer support services, are key differentiators for our business. I am excited to be working with our global teams to build our strength and continue extending our advantage.”
Ventec’s product portfolio encompasses signal integrity/high-speed digital, RF/Analog & high-performance IMS material technology, and an advanced range of thermal management solutions designed for specialized use in industries including automotive, communication, aerospace, and defense. The comprehensive product line includes pro-bond and thermal-bond resin-coated films for signal-integrity applications, flex/flex-rigid and thin-flex products, and materials for special applications. The group also provides value added technical services, lab capabilities, and capital equipment for PCB fabrication.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Changing the Electronics Systems Conversation
02/16/2026 | Nolan Johnson, SMT007 MagazineRebranding as the Global Electronics Association is not the only major change happening at APEX EXPO this year. There’s also a shift in the scope of the technical program as heterogenous integration and other advanced packaging methodologies come into the mainstream at both the component and system levels. We spoke with Matt Kelly, CTO and conference general chair, Devan Iyer, chief strategist for advanced electronic packaging, and Stan Rak and Udo Welzel, now in their fourth year as chairs of the Technical Program Committee, about what distinguishes the conference this year.
Advanced Rework Technology Named IPC Electronics Training Provider of the Year
02/12/2026 | Advanced Rework TechnologyAdvanced Rework Technology (A.R.T.), a UK-based provider of IPC-certified electronics training and independent technical consultancy, has been named Electronics Training Provider of the Year as part of the 2026 Awards of Excellence programme.
February Issue of Advanced Electronics Packaging Digest Examines the Evolving Role of Packaging
02/11/2026 | I-Connect007 Editorial TeamI-Connect007 is excited to announce that the upcoming issue of Advanced Electronics Packaging Digest (AEPD) will be delivered to subscriber inboxes on Feb. 16, offering in-depth perspectives on the technologies and system-level thinking shaping the future of electronics packaging. As performance demands rise, advanced packaging is increasingly central to integration across the electronics ecosystem. This issue of AEPD examines how packaging decisions increasingly influence design, materials selection, manufacturing strategy, and overall system performance.
PEDC: Built for the Design Community by the Design Community
02/05/2026 | Peter Tranitz, Global Electronics AssociationThe Pan-European Electronics Design Conference (PEDC) was developed to provide Europe’s electronics design community with a non-commercial, Pan-European, technologically advanced forum. PEDC 2026 delivered exactly that. This second edition of the conference brought together 130 participants from 23 countries across Europe and beyond for two days of technical exchange, discussion, and connection. Hosted by the Global Electronics Association and Fachverband Elektroniksdesign und-fertigung e.V. (F.E.D)., and supported by Altium, Siemens, and Zuken, the event featured three technical tracks, 36 presentations, three keynotes, and a group of exhibitors.
Volker Klafki Joins Ventec as Senior Technical Engineer for EMEA
02/04/2026 | VentecVentec International Group is delighted to announce the appointment of Volker Klafki as Senior Technical Engineer for EMEA.