Happy’s Tech Talk #34: Producibility and Other Pseudo-metrics
It’s Only Common Sense: Results Come from Action, Not Intention
The New Chapter: Navigating Maternity Leave in the Electronics Industry
Fall 2024 Issue of IPC Community Now Available
October 14, 2024 | IPC Community Editorial TeamEstimated reading time: 1 minute
There’s so much happening at IPC, so be sure to open the latest issue of IPC Community, brimming with must-read features on members of the electronics industry who are making a difference in their own unique way.
Just for starters, our member profiles feature Virginia-based Weidmuller, a heart-warming story from E-Tron, and you’ll discover how the owners of Out of the Box Manufacturing are successfully tackling workforce talent challenges.
We feature an in-depth conversation with European market researcher Dieter Weiss, who’s giving back to the industry through data research, and you must read about the somewhat unconventional but ultimately satisfying sustainability-driven lifestyle of IPC course instructor Kris Moyer.
IPC Chief Economist Shawn DuBravac breaks down inventory costs following the pandemic, while IPC Japan Representative Yusaku Kono gives an update on how Japan’s electronics economy is recovering after the pandemic and the phenomenal growth of IPC standards and certifications in Japan.
Regarding sustainability, IPC Community visited with Zhou (Peter) Guoyin, a pioneer in ESG standards. You can also learn more about circularity in electronics from IPC's Lead Sustainability Strategist, Kelly Scanlon, and Stanley Merritt, a member of the IPC Sustainability Leadership Council, who educates us on supply chain sustainability, particularly in aerospace and defense.
We’ve devoted a special section to IEMI, the premier electronics manufacturing trade show sponsored by IPC India, which crossed borders this year to host events in Malaysia and India with great success. Dr. John W. Mitchell, president and CEO of IPC, attended both events and shares his insights on what it means to host the event in Malaysia.
For printed circuit board designers, we've highlighted the Pan-European Design Conference in January, where you can learn how to participate in this exciting new opportunity in Vienna.
As always, you’ll discover instructor-led courses happening this winter, learn about the latest standards releases, and see what's happening around the world with IPC in our Q4 calendar.
So, settle in with your favorite pumpkin-spiced treat and enjoy our latest issue!
Share on:
Suggested Items
TRI at SMTA Silicon Valley Expo & Tech Forum 2024
11/12/2024 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, will join the SMTA Silicon Valley Expo & Tech Forum 2024 on December 5, 2024, at the Fremont Marriott Silicon Valley.
Electronics Manufacturing Association Statement on U.S. Election Results
11/08/2024 | IPCJohn Mitchell, President and CEO of IPC, the global electronics manufacturing industry association, issued the following statement on the United States’ election results:
Meeting in Vienna: PCB Designers Invited to Engage in the Silicon to Systems Process
11/08/2024 | Michelle Te, IPC CommunityPCB designers interested in innovative ideas, technical prowess, relevance, quality, and doing their best work can now register for the inaugural Pan-European Electronics Design Conference (PEDC), Jan. 29-30, 2025, in Vienna, Austria.
Nolan's Notes: The Rise (and Risk) of Data
11/05/2024 | Nolan Johnson -- Column: Nolan's NotesLast month, I read about a United Airlines flight that declared an emergency over the middle of Hudson Bay in northern Canada. All the cockpit screens had gone blank and both flight management computers had entered into a “degraded mode with limited capabilities.” The pilots had lost most of their autopilot functionality, but still had enough control systems to manually fly the plane to a safe landing at O’Hare.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.