Fall 2024 Issue of IPC Community Now Available
October 14, 2024 | IPC Community Editorial TeamEstimated reading time: 1 minute
There’s so much happening at IPC, so be sure to open the latest issue of IPC Community, brimming with must-read features on members of the electronics industry who are making a difference in their own unique way.
Just for starters, our member profiles feature Virginia-based Weidmuller, a heart-warming story from E-Tron, and you’ll discover how the owners of Out of the Box Manufacturing are successfully tackling workforce talent challenges.
We feature an in-depth conversation with European market researcher Dieter Weiss, who’s giving back to the industry through data research, and you must read about the somewhat unconventional but ultimately satisfying sustainability-driven lifestyle of IPC course instructor Kris Moyer.
IPC Chief Economist Shawn DuBravac breaks down inventory costs following the pandemic, while IPC Japan Representative Yusaku Kono gives an update on how Japan’s electronics economy is recovering after the pandemic and the phenomenal growth of IPC standards and certifications in Japan.
Regarding sustainability, IPC Community visited with Zhou (Peter) Guoyin, a pioneer in ESG standards. You can also learn more about circularity in electronics from IPC's Lead Sustainability Strategist, Kelly Scanlon, and Stanley Merritt, a member of the IPC Sustainability Leadership Council, who educates us on supply chain sustainability, particularly in aerospace and defense.
We’ve devoted a special section to IEMI, the premier electronics manufacturing trade show sponsored by IPC India, which crossed borders this year to host events in Malaysia and India with great success. Dr. John W. Mitchell, president and CEO of IPC, attended both events and shares his insights on what it means to host the event in Malaysia.
For printed circuit board designers, we've highlighted the Pan-European Design Conference in January, where you can learn how to participate in this exciting new opportunity in Vienna.
As always, you’ll discover instructor-led courses happening this winter, learn about the latest standards releases, and see what's happening around the world with IPC in our Q4 calendar.
So, settle in with your favorite pumpkin-spiced treat and enjoy our latest issue!
Suggested Items
Are Our Stackup Rules No Longer Valid?
12/19/2024 | Cherie Litson, EPTAC MIT CID/CID+Are the stackup rules we used to follow no longer valid? It depends on what you’re designing. Electrical rules change depending on your circuit. Fabrication rules change depending on which fabricator you’re working with. Today, we just have more options, and sometimes, cost is a bigger rule than anything else. If you search online for information about layer stackups, trace widths, and hole sizes in PCBs, you’ll find a variety of resources.
IPC/WHMA Launches Groundbreaking Online Course on Wire Harness Design
12/18/2024 | IPCIPC/WHMA is excited to announce the launch of its new online instructor-led training course, "Introduction to Wire Harness Design I," available now through the IPC EDGE Learning Management System.
IPC Releases Latest List of Standards and Revisions
12/17/2024 | IPC Community Editorial TeamEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q4 2024.
IPC, FED Partner for New Design Conference in Vienna
12/12/2024 | Andy Shaughnessy, Design007 MagazineIPC and its German partner FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) is scheduled for Jan. 29-30 at the NH Danube City hotel in Vienna. IPC’s Peter Tranitz, one of the show organizers, discussed how this new show came about, pointing out that, unlike many of the regional conferences in Europe, PEDC will host curated, peer-reviewed presentations, not promotional content or product pitches. Will PEDC become an annual event?
Happy’s Tech Talk #35: Yields March to Design Rules
12/12/2024 | Happy Holden -- Column: Happy’s Tech TalkUltra high density interconnect (UHDI) has many forms, structures, and alternatives, so capturing all the variations and reducing them to design rules has required some departures from traditional IPC design standards. In this column, I’ll be discussing the IPC UHDI design guidelines and standards. The fundamental question is: “Do you need HDI or microvias?”