EdgeCortix Joins AI-RAN Alliance to Accelerate the Integration of AI and Next-gen RAN Infrastructure
December 20, 2024 | EdgeCortixEstimated reading time: 1 minute
EdgeCortix, a leading fabless semiconductor company specializing in power-efficient AI processing, today announced its membership in the AI-RAN Alliance. This collaboration represents a significant step in EdgeCortix’s commitment to drive the seamless integration of artificial intelligence (AI) and radio access network (RAN) technologies into a unified computing platform, paving the way for more efficient and scalable wireless connectivity.
The AI-RAN Alliance unites industry leaders and innovators to accelerate the adoption and standardization of AI within wireless communication systems, advancing RAN technologies and mobile networks. As a member, EdgeCortix will leverage its expertise in AI acceleration and wireless acceleration hardware to support the Alliance’s mission of building smarter, adaptive, and energy-efficient network infrastructure for AI-and-RAN.
“With the rapid evolution of 5G and post-5G communication networks, the need for high-performance, energy-efficient, and integrated AI and RAN computing systems has become more pressing than ever,” said Sakyasingha Dasgupta, CEO and Founder of EdgeCortix. “At EdgeCortix, we are developing a next-generation low-power chiplet platform that combines our proven AI acceleration technology with newly integrated wireless acceleration capabilities. Joining the AI-RAN Alliance represents an exciting opportunity to collaborate with industry leaders to establish standards, share best practices, and drive innovation in AI-RAN integrated systems. Together, we aim to enhance infrastructure efficiency from the edge to the data center, unlocking new economic opportunities and reshaping the future of telecommunications.”
The AI-RAN Alliance harnesses the collective expertise of its members, including EdgeCortix, to transform RAN technology across three critical areas:
- AI-for-RAN: Enhancing radio access networks with AI to improve spectral efficiency.
- AI-and-RAN: Seamlessly integrating AI into RAN processes to optimize infrastructure utilization and unlock new revenue streams.
- AI-on-RAN: Bringing AI services to the network edge to boost operational efficiency and deliver innovative services to mobile users.
Network operators and mobile connectivity solution providers in the Alliance will lead the testing and deployment of these groundbreaking technologies, developed collaboratively by member companies and academic partners, driving the future of intelligent, adaptive network infrastructure.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Zhen Ding Technology Highlights AI-Driven Transformation of the PCB Industry at SEMICON Taiwan 2025
09/11/2025 | Zhen Ding TechnologyArtificial intelligence (AI) is expanding rapidly, with almost no field left untouched by the wave of computing power-driven transformation.
Safran, PGZ Reinforce Defense Partnership Through Innovation and Local Industrial Cooperation
09/08/2025 | SafranSafran Electronics & Defense, a leading European high-technology company in aerospace and defense, and Polska Grupa Zbrojeniowa S.A. (PGZ), Poland’s primary defense industry leader, have signed two Memorandums of Understanding (MoU) to further expand their collaboration in support of European security and industrial cooperation during the International Defense Industry Exhibition (MSPO) held in Kielce.
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.
Hitachi Unveils $1B U.S. Investment in Critical Grid Infrastructure
09/05/2025 | Hitachi EnergyHitachi Energy, a wholly owned subsidiary of Hitachi, Ltd., and global leader in electrification, today announced a historic investment of more than $1 billion USD to expand the production of critical electrical grid infrastructure in the United States.
AiM Future, Franklin Wireless Sign MOU to Jointly Develop Lightweight AI Model and High-Efficiency 1 TOPS AI SoC Chipset
09/01/2025 | BUSINESS WIREAiM Future, a leading AI semiconductor design company, has signed a Memorandum of Understanding (MOU) with Franklin Wireless Corp., a global leader in intelligent wireless solutions, to jointly develop a lightweight AI model and a high-efficiency 1 TOPS performance AI SoC chipset.