Facing the Future: Successfully Navigating the Uncertain Path Ahead
It’s Only Common Sense: Going After the Small Wins Fosters a Winning Culture
The Chemical Connection: Surface Finishes for PCBs
iNEMI Packaging Tech Topic Webinar: Navigating Advanced IC Substrate Technology and Market Trends
October 15, 2024 | iNEMIEstimated reading time: 1 minute
The increasing demands of artificial intelligence (AI), machine learning (ML), and high-performance computing (HPC) are driving requirements at all levels of the semiconductor supply chain with different levels of complexity and demands. As performance requirements outpace traditional silicon scaling, the industry has turned to advanced IC substrates and advanced packaging technologies to meet the growing need for higher power efficiency, greater interconnect density, and larger form factors.
The emergence of glass core substrates is especially promising and is attracting attention and interest. These substrates offer superior mechanical, thermal, and electrical properties compared to organic substrates. The arrival of glass pushes beyond the limitations and challenges of organic substrates to be considered an option for AI and HPC products and not a bottleneck.
In this presentation, Dr. Hachemi will explore the latest trends and roadmaps in advanced IC substrates, focusing on the roles of organic and glass core technologies in enhancing package-level integration for AI and HPC applications. He will discuss the industry's progress in adopting glass substrates and trends in areas such as interconnect scaling, thermal management, and substrate reliability. Additionally, the presentation will map new investments and capacity expansions around the globe.
About the Speaker
M. Bilal Hachemi, Ph.D.
Technology and Market Analyst, Yole Group
Working with the Manufacturing & Global Supply Chain activities at Yole Group, Dr. Hachemi contributes on a day-to-day basis to the analysis of packaging technologies, their related materials and manufacturing processes. Previously, he carried out experimental research in the field of nanoelectronics and nanotechnologies, focusing on emerging dielectric materials and their ferroelectric applications. Dr. Hachemi has co-authored several papers in high-impact scientific journals and participated in several international conferences. He earned a Ph.D. in nanoelectronics from the Grenoble Alpes University (France) and studied at IAE Grenoble for a master’s degree in management.
Registration
This webinar is open to industry; advance registration is required, please click here.
Wednesday, November 6, 2024
8:00-9:00 a.m. EST (US)
2:00-3:00 p.m. CET (Europe)
10:00-11:00 p.m. JST (Japan)
Share on:
Suggested Items
TASMIT Launches Large Glass Substrate Inspection System for Advanced Semiconductor Packaging
03/04/2025 | ACCESSWIRETASMIT Inc. has launched a new inspection system for glass substrates as part of its INSPECTRA® series of semiconductor wafer visual inspection systems, which has gained attention for its high efficiency in advanced semiconductor manufacturing.
AGC Multi Material to Showcase Substrate Materials at DesignCon 2025
12/31/2024 | AGC Multi Material AmericaAGC Multi Material America (AMMA) is participating in the DesignCon exhibition in Santa Clara, California, Jan. 28-30, 2025.
IPC Releases Latest List of Standards and Revisions
12/17/2024 | IPC Community Editorial TeamEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q4 2024.
Biden-Harris Administration Announces CHIPS Incentives Awards with Absolics and Entegris
12/06/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.