iNEMI Packaging Tech Topic Webinar: Navigating Advanced IC Substrate Technology and Market Trends

Estimated reading time: 1 minute

The increasing demands of artificial intelligence (AI), machine learning (ML), and high-performance computing (HPC) are driving requirements at all levels of the semiconductor supply chain with different levels of complexity and demands. As performance requirements outpace traditional silicon scaling, the industry has turned to advanced IC substrates and advanced packaging technologies to meet the growing need for higher power efficiency, greater interconnect density, and larger form factors.

The emergence of glass core substrates is especially promising and is attracting attention and interest. These substrates offer superior mechanical, thermal, and electrical properties compared to organic substrates. The arrival of glass pushes beyond the limitations and challenges of organic substrates to be considered an option for AI and HPC products and not a bottleneck.

In this presentation, Dr. Hachemi will explore the latest trends and roadmaps in advanced IC substrates, focusing on the roles of organic and glass core technologies in enhancing package-level integration for AI and HPC applications. He will discuss the industry's progress in adopting glass substrates and trends in areas such as interconnect scaling, thermal management, and substrate reliability. Additionally, the presentation will map new investments and capacity expansions around the globe.

About the Speaker

M. Bilal Hachemi, Ph.D.
Technology and Market Analyst, Yole Group

Working with the Manufacturing & Global Supply Chain activities at Yole Group, Dr. Hachemi contributes on a day-to-day basis to the analysis of packaging technologies, their related materials and manufacturing processes. Previously, he carried out experimental research in the field of nanoelectronics and nanotechnologies, focusing on emerging dielectric materials and their ferroelectric applications. Dr. Hachemi has co-authored several papers in high-impact scientific journals and participated in several international conferences. He earned a Ph.D. in nanoelectronics from the Grenoble Alpes University (France) and studied at IAE Grenoble for a master’s degree in management.

Registration

This webinar is open to industry; advance registration is required, please click here.

Wednesday, November 6, 2024
8:00-9:00 a.m. EST (US)
2:00-3:00 p.m. CET (Europe)
10:00-11:00 p.m. JST (Japan)