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October 15, 2024 | Koh Young TechnologyEstimated reading time: 2 minutes
Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions at Messe München on November 12-15, 2024. At electronica Booth A3.358, our team of experts will be on hand to discuss how our AOI, SPI and DPI solutions boost your quality and increase your yield. At the parallel event SEMICON Europa Booth C2.549, our application engineering team will be showcasing our superior quality semiconductor inspection solutions for advanced and wafer-level packaging.
For PCB Assembly Professionals: electronica Booth A3.358
At electronica Booth A3.358, Koh Young’s experts will demonstrate how our Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and Dispensed Material Inspection (DPI) solutions can enhance your production quality and yield. There we will be highlighting three systems uniquely positioned to provide solutions for your challenges:
Zenith Alpha A cutting-edge True 3D AOI solution driven by artificial intelligence and machine learning. The Zenith Alpha integrates advanced mechatronics and algorithms to deliver top-tier performance without sacrificing accuracy.
KY8030-2 As the best-selling True 3D Solder Paste Inspection system, the KY8030-2 features Koh Young’s patented dual-inspection Moiré projection technology, overcoming the challenges of shadow and specular reflection other systems cannot.
Neptune C+ Protect your electronics with confidence. Koh Young’s L.I.F.T. technology (Laser Interferometry for Fluid Tomography) ensures precise, non-destructive 3D inspection of conformal coatings, whether wet or dry.
For Semiconductor Professionals: SEMICON Europa Booth C2.549
Meanwhile, at SEMICON Europa Booth C2.549, we will showcase inspection technologies specifically designed for semiconductor and advanced packaging applications, including wafer-level packaging solutions. Our team of inspection experts will highlight three different machines, including:
Meister S Qualified by leading semiconductor foundries and Mini/Micro-LED companies, the Meister S delivers full 3D inspection for micro solder and flux inspection applications, combining high-resolution optics with innovative vision algorithms.
Meister D This system offers high-speed 3D inspection of both small components like MLCCs and silicon die. Powered by advanced optics and AI-driven defect analysis, the Meister D detects microcracks, chipping, foreign materials, and more.
Meister D+ Breakthrough True 3D inspection technology for high-density substrates and highly reflective components. The Meister D+ leverages Koh Young’s new proprietary optics and Moiré technology to achieve accurate 3D inspection of mirror-finish reflective dies and challenging surfaces.
Visit Us and Elevate Your Inspection Capabilities
For more information about how Koh Young’s award-winning solutions can elevate your production quality and solve your most challenging inspection needs, visit us at electronica Booth A3.358 or SEMICON Europa Booth C2.549. Do not miss this opportunity to engage with our experts, experience our innovative technologies firsthand, and discover how we can help you achieve new levels of efficiency in your manufacturing processes.
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