The New Chapter: The Benefits of Continuing Education
It’s Only Common Sense: You’ve Got to Hustle
Indium Experts to Present at International Electronics Manufacturing Technology Conference
October 15, 2024 | Indium CorporationEstimated reading time: 2 minutes
Indium Corporation is proud to announce its participation in the upcoming International Electronics Manufacturing Technology Conference (IEMT), taking place October 16-18 in Penang, Malaysia. Five experts from Indium Corporation will present their cutting-edge research on Pb-free soldering solutions that address critical challenges in modern power electronics and advanced packaging applications.
Indium Corporation Strategic Advisor Dr. Dongkai Shangguan will deliver a keynote presentation, titled Materials and Reliability for Advanced Packaging and Heterogeneous Integration. The keynote will explore the increasing complexity of interconnect reliability in advanced packaging, driven by the demand for high-density, high-performance applications and the rise of heterogeneous integration.
Product Manager (Semiconductor) Dean Payne will deliver a presentation, titled Making the Move from High-Pb Solder to Pb-Free for Die-Attach in Discrete Power Devices. It will highlight the shift from traditional high-lead (Pb) solder to Pb-free alternatives for die attach applications in discrete power devices. This session will provide insights into the future of die attach solutions and how Indium Corporation is innovating to address these challenges and find a sustainable Pb-free solution for power discrete die attach.
The following presentation will be given by R&D Sintering Project Manager Demi Yao, and is titled Pressure and Pressure-less Cu Sintering Paste Developed for Next-Generation Interconnection Material. This session will offer insights into high-reliability copper (Cu) sintering pastes developed for high-power applications, offering key advantages such as low cost, high thermal and electrical conductivity, and elimination of the need for precious metal plating like gold or silver.
Additionally, Assistant Product Manager for Power Electronics Sunny Neoh will offer a poster presentation, titled Low- and Mid-Temperature Pb-Free Solder Preform Technology in Substrate Attach Application for Improved Thermomechanical Performance. The presentation will explore advancements in low- and mid-temperature Pb-free solder preform technologies for substrate attach in high-power density electronics. It will also highlight the development of high-reliability alloys, such as SAC-In, Sn-Sb, and SAC-Sb, which are designed to withstand thermal cycling and improve the performance of large-area solder joints.
Research Chemist Mary Li Ma will also deliver a poster presentation, titled Voiding Control of Lead-Free Soldering at Quad-Flat No-Lead Package Components. This presentation addresses the challenge of controlling thermal pad voiding in quad-flat no-leads (QFN) packages, which is critical for applications where size, weight, and thermal properties matter. Through this study, a low-voiding paste was developed, offering a reliable solution for improved QFN performance.
For more information on Indium Corporation’s Pb-free soldering solutions, visit our experts at IEMT, at Booth #1.
Share on:
Suggested Items
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
The Chemical Connection: Getting the Best from Your Cupric Chloride Etchant
12/04/2024 | Don Ball -- Column: The Chemical ConnectionOver the past several months, we have received a lot of questions from our customers about cupric chloride etching—mostly about how to improve etch quality, but also about process problems. Most of them were easily dealt with, but the questions arose because the people involved in running the etching process were not aware of the finer nuances involved in using cupric chloride as the primary etchant. (They don’t have courses on etching in most colleges and trade schools.) I thought this might be a good time to summarize some things I have learned in my 50 years of experience with cupric chloride etching and clear up some of the confusion.
Hon Hai’s Efforts to Create a Friendlier Workplace Environment Were Recognized by the American Ragan Award
11/11/2024 | Hon Hai Technology GroupThe Ragan CSR & DIVERSITY AWARDS awards were held grandly at the Yale Club in New York a few days ago. Hon Hai Technology Group, the world’s largest technology manufacturer and service provider Participated in the selection with the "Diverse, Fair and Inclusive Disability Service Plan" and stood out from the competition, winning the award in the ESG activity category.
SMTA Austin Expo & Tech Forum Returns February 6, 2025
10/30/2024 | SMTAThe Surface Mount Technology Association (SMTA) Austin Expo & Tech Forum is set to take place on Thursday, February 6, 2025 from 8:30 a.m. - 4:00 p.m. at the Travis County Exposition Center.
KYZEN to Feature AQUANOX A4618 and KYZEN SLV901 at SMTA Empire Expo and Tech Forum
09/18/2024 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Empire Expo and Tech Forum, scheduled to take place Thursday, September 26 at the DoubleTree by Hilton in Syracuse, NY.