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SEMICON Europa 2024 to Explore Innovations in Advanced Packaging and Fab Management for a Sustainable Future
October 15, 2024 | SEMIEstimated reading time: 2 minutes
Semiconductor industry experts will convene at SEMICON Europa 2024, November 12-15 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management. The Advanced Packaging Conference (APC) and Fab Management Forum (FMF) at SEMICON Europa will each focus on driving sustainable solutions to meet the evolving demands of the semiconductor market. Co-located with electronica, SEMICON Europa is the region’s premier event connecting the entire electronics design and manufacturing supply chain. Registration is open for APC and FMF.
SEMICON Europa"Global collaboration across the semiconductor industry is essential for driving sustainable, exponential growth,” said Laith Altimime, president of SEMI Europe. ”SEMI Europe Advanced Packaging Conference and Fab Management Forum provide invaluable platforms for stakeholders to share insights and innovations, ensuring we leverage cutting-edge technologies and strategies that enhance performance while paving the way for a more sustainable future."
Advanced Packaging Conference ─
Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency
Demand for High Performance Computing (HPC) is increasing, driven by advancements in artificial intelligence and Large Language Models like ChatGPT. HPC’s expansion requires innovative solutions in chiplet design, heat dissipation, and power optimization. The upcoming APC will provide a platform to explore enhancing each of these developments, highlighting collaboration among academia, industry, and government.
This year’s APC will focus on:
- The Role of Chiplets in Enhancing Performance and Efficiency
- Power Optimization Techniques for Next-Generation Applications
- Advances in Miniaturization and Material Integration
- Innovations in Heat Dissipation and Thermal Management
- Collaborations Across Academia, Industry, and Government
Speakers include experts from Amkor Technology, ASE Global, Atotech an MKS Brand, Besi, Chip Integration Technology Center (CITC), Comet Yxlon, EV Group (EVG), Evatec, GlobalFoundries, Guangdong Fenghua Semiconductor Technology, Henkel, IBM, Infineon Technologies, JCET, Koh Young Europe, QuantumDiamonds, RHP-Technology, RoodMicrotec, Robovision, STATS ChipPAC, and SUSS MicroTec.
The conference is sponsored by ASE Global, Atotech an MKS Brand, Comet Yxlon, IBM, Koh Young Europe and SUSS MicroTec.
Fab Management Forum ─
Driving Innovation: Competitive, Sustainable and Collaborative Strategies
To meet its evolving demands, the semiconductor industry must adopt competitive, sustainable, and collaborative strategies that enhance fab efficiency and performance. Industry stakeholders can develop innovative solutions for a sustainable future by integrating cutting-edge technologies and fostering partnerships. This year’s FMF will focus on:
- Key Strategies in a Global Market Landscape
- Advancing Smart Manufacturing Solutions
- Europe's Environmental Transition: Stability to Sustainability
- Next-Gen Core Technologies for Future Fabs
Speakers include experts from Algorismic, ams OSRAM, BMW Group, Comet Yxlon, Flexciton, Infineon Technologies, INFICON, imec, Kontron AIS, minds.ai, Robert Bosch Semiconductor Manufacturing, STMicroelectronics, Synopsys, Texas Instruments, Tokyo Electron Europe, Watlow, and X-Fab.
Suggested Items
Tata Electronics, Bosch Sign MoU for Strategic Collaboration in Electronics and Semiconductor Manufacturing
07/18/2025 | Tata ElectronicsTata Electronics, a leading player in the Indian electronics and semiconductor manufacturing sector, and Robert Bosch GmbH, a leading global supplier of technology and services, announced that they have signed a Memorandum of Understanding (MoU) to collaborate on several key areas within the electronics and semiconductor industries.
Fraunhofer IPMS, DIVE Optimize Semiconductor Processes with Cutting-Edge Measurement System
07/17/2025 | Fraunhofer IPMSThe Fraunhofer Institute for Photonic Microsystems IPMS, in collaboration with DIVE imaging systems GmbH, has achieved a major milestone in resource-efficient semiconductor manufacturing.
TI Honored by Volkswagen Group for Operational Excellence
07/16/2025 | Texas InstrumentsTexas Instruments (TI) received the prestigious “Operational Excellence” award at the annual Volkswagen Group Award 2025 in Wolfsburg, Germany.
Report: Broadcom Scraps $1 Billion Chip Investment in Spain
07/15/2025 | I-Connect007 Editorial TeamAmerican chipmaker Broadcom has pulled out of plans to invest in a microchip plant in Spain. According to a July 14 Reuters report, Europa Press, quoting anonymous sources, stated the action followed collapsed government talks but gave no further information.
Siemens Collaborates with SK keyfoundry to Launch 130nm Automotive Power Semiconductor Calibre PERC PDK
07/15/2025 | SiemensSiemens Digital Industries Software announced that SK keyfoundry, in collaboration with Korea Siemens EDA, has launched a 130nm automotive PDK (Process Design Kit) that is exclusively designed for use in Calibre® PERC™ software.