-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueCounterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
A Culture of Thriving
One cannot simply command thriving; it must be nurtured, developed, and encouraged. In this issue, we explore strategies to improve your working relationship model—both internally and externally. In this culture of thriving, your business will grow in the process.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
SEMICON Europa 2024 to Explore Innovations in Advanced Packaging and Fab Management for a Sustainable Future
October 15, 2024 | SEMIEstimated reading time: 2 minutes
Semiconductor industry experts will convene at SEMICON Europa 2024, November 12-15 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management. The Advanced Packaging Conference (APC) and Fab Management Forum (FMF) at SEMICON Europa will each focus on driving sustainable solutions to meet the evolving demands of the semiconductor market. Co-located with electronica, SEMICON Europa is the region’s premier event connecting the entire electronics design and manufacturing supply chain. Registration is open for APC and FMF.
SEMICON Europa"Global collaboration across the semiconductor industry is essential for driving sustainable, exponential growth,” said Laith Altimime, president of SEMI Europe. ”SEMI Europe Advanced Packaging Conference and Fab Management Forum provide invaluable platforms for stakeholders to share insights and innovations, ensuring we leverage cutting-edge technologies and strategies that enhance performance while paving the way for a more sustainable future."
Advanced Packaging Conference ─
Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency
Demand for High Performance Computing (HPC) is increasing, driven by advancements in artificial intelligence and Large Language Models like ChatGPT. HPC’s expansion requires innovative solutions in chiplet design, heat dissipation, and power optimization. The upcoming APC will provide a platform to explore enhancing each of these developments, highlighting collaboration among academia, industry, and government.
This year’s APC will focus on:
- The Role of Chiplets in Enhancing Performance and Efficiency
- Power Optimization Techniques for Next-Generation Applications
- Advances in Miniaturization and Material Integration
- Innovations in Heat Dissipation and Thermal Management
- Collaborations Across Academia, Industry, and Government
Speakers include experts from Amkor Technology, ASE Global, Atotech an MKS Brand, Besi, Chip Integration Technology Center (CITC), Comet Yxlon, EV Group (EVG), Evatec, GlobalFoundries, Guangdong Fenghua Semiconductor Technology, Henkel, IBM, Infineon Technologies, JCET, Koh Young Europe, QuantumDiamonds, RHP-Technology, RoodMicrotec, Robovision, STATS ChipPAC, and SUSS MicroTec.
The conference is sponsored by ASE Global, Atotech an MKS Brand, Comet Yxlon, IBM, Koh Young Europe and SUSS MicroTec.
Fab Management Forum ─
Driving Innovation: Competitive, Sustainable and Collaborative Strategies
To meet its evolving demands, the semiconductor industry must adopt competitive, sustainable, and collaborative strategies that enhance fab efficiency and performance. Industry stakeholders can develop innovative solutions for a sustainable future by integrating cutting-edge technologies and fostering partnerships. This year’s FMF will focus on:
- Key Strategies in a Global Market Landscape
- Advancing Smart Manufacturing Solutions
- Europe's Environmental Transition: Stability to Sustainability
- Next-Gen Core Technologies for Future Fabs
Speakers include experts from Algorismic, ams OSRAM, BMW Group, Comet Yxlon, Flexciton, Infineon Technologies, INFICON, imec, Kontron AIS, minds.ai, Robert Bosch Semiconductor Manufacturing, STMicroelectronics, Synopsys, Texas Instruments, Tokyo Electron Europe, Watlow, and X-Fab.
Suggested Items
SIA Applauds CHIPS Act Incentives for Wolfspeed Manufacturing in North Carolina and New York
10/16/2024 | SIAThe Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Wolfspeed.
Seoul Semiconductor Illuminates Its Wired and Wireless Networking Experience with Juniper Networks
10/14/2024 | BUSINESS WIREJuniper Networks, a leader in secure, AI-Native Networking, announced that its AI-Native Networking Platform has been deployed by Seoul Semiconductor to deliver predictable, reliable and measurable wired and wireless access services that increase employee productivity while minimizing operational costs.
Iridium to Collaborate with Nordic Semiconductor on Iridium NTN Direct integration
10/11/2024 | PRNewswireIridium Communications Inc., a leading provider of global voice and data satellite communications, announced its collaboration with Nordic Semiconductor for early integration of its Iridium NTN Direct℠ service into Nordic's LTE-M/NB-IoT modules and chipsets.
Keysight Unveils 3kV High Voltage Wafer Test System for Power Semiconductors
10/10/2024 | BUSINESS WIREKeysight Technologies, Inc. introduces a 4881HV High Voltage Wafer Test System expanding its semiconductor test portfolio. The solution improves the productivity of power semiconductor manufacturers by enabling parametric tests up to 3kV supporting high and low-voltage in one-pass test.
Amkor, TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona
10/08/2024 | TSMCAmkor Technology, Inc. and TSMC announced that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region’s semiconductor ecosystem.