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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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PCB007 Magazine October 2024: Alternate Metallization Processes
October 16, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop. In the October 2024 issue of PCB007 Magazine, we examine alternate metallization methods, including MacDermid Alpha’s graphite technology and Uyemura’s RAIG technology.
In addition, John Johnson of American Standard Circuits discusses liquid metal ink as a process technology alternative. Dyconex talks about alternative metal elements from the standpoint of R&D and explains sputtering technology. And we revisit Mike Carano’s comprehensive overview of direct metallization technology from our July 2024 issue of PCB007 Magazine.
For all of that and more, get onboard for destination metallization.
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