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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Avnet Announces Release of Autodesk Fusion Integration
October 16, 2024 | AvnetEstimated reading time: Less than a minute
Design engineers can now access thousands of reference design schematics, lead time and pricing trends, and fast alternate guidance with the launch of the Avnet App, an add-in for Autodesk Fusion.
Avnet is the first to add these design capabilities and insights via a globally available add-in to the Autodesk Fusion solution. The Avnet App will give design engineers access to a powerful part search, alternates library, project cost and supply chain health analysis, datasheets, component symbols and more.
Autodesk Fusion is a cloud-based 3D modeling, CAD, CAM, PCB and mechanical engineering solution for product design and manufacturing. Avnet’s new features are offered as a Fusion add-in to streamline design workflow, helping design engineers meet functional requirements, cost targets, manufacturing goals, and lifecycle timelines.
“As a key technology partner in the early stages of design and product realization, Avnet provides engineers with valuable tools through the app,” said Chris Jackson, VP, Digital Strategy and Innovation, Avnet. “The reference design library is full of schematics and project descriptions that engineers can directly place into their designs with a simple in-app search in as few as three clicks.”
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Zuken Launches GENESYS 2026 to Broaden Access and Improve MBSE Workflows
04/28/2026 | ZukenZuken announced GENESYS 2026, the latest version of its model-based systems engineering platform, with updates designed to improve performance, expand access to model-based information, and enhance the day-to-day modeling experience for engineering teams.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?
Cadence Reports Q1 2026 Financial Results
04/28/2026 | Cadence Design SystemsCadence had a strong start to 2026, delivering a solid Q1 with accelerating AI demand and record backlog, reflecting strong customer commitment to our AI-driven portfolio,” said Anirudh Devgan, president and chief executive officer.
Tomachie Launches AI-Powered PCB Analysis with Smart Test Point Insertion
04/28/2026 | TomachieTomachie announced its AI-Assisted PCB schematic design analysis platform, enabling engineering teams to evaluate and improve schematic quality before layout begins. Schematic errors caught after layout — or in production — cost 10 to 100 times more to fix than those caught during schematic capture.
Call for Abstracts for Third Pan-European Electronics Design Conference
04/27/2026 | Global Electronics AssociationThe German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association are officially opening the Call for Abstracts for the Third Pan-European Electronics Design Conference (PEDC).