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Avnet Announces Release of Autodesk Fusion Integration
October 16, 2024 | AvnetEstimated reading time: Less than a minute
Design engineers can now access thousands of reference design schematics, lead time and pricing trends, and fast alternate guidance with the launch of the Avnet App, an add-in for Autodesk Fusion.
Avnet is the first to add these design capabilities and insights via a globally available add-in to the Autodesk Fusion solution. The Avnet App will give design engineers access to a powerful part search, alternates library, project cost and supply chain health analysis, datasheets, component symbols and more.
Autodesk Fusion is a cloud-based 3D modeling, CAD, CAM, PCB and mechanical engineering solution for product design and manufacturing. Avnet’s new features are offered as a Fusion add-in to streamline design workflow, helping design engineers meet functional requirements, cost targets, manufacturing goals, and lifecycle timelines.
“As a key technology partner in the early stages of design and product realization, Avnet provides engineers with valuable tools through the app,” said Chris Jackson, VP, Digital Strategy and Innovation, Avnet. “The reference design library is full of schematics and project descriptions that engineers can directly place into their designs with a simple in-app search in as few as three clicks.”
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Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.