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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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CIMS to Showcase Advanced Solutions at TPCA 2024
October 17, 2024 | CIMSEstimated reading time: Less than a minute

CIMS, a leading provider of inspection solutions for the electronics manufacturing industry, will be exhibiting at the Taiwan Printed Circuit Association (TPCA) 2024 exhibition in Taipei from October 23-25.
At booth L513, CIMS will showcase several innovative products and solutions, including Spark™ 4.0, a next-generation software inspection engine with powerful new functionalities.
The company will also present its latest inspection solution for the most advanced segment of IC substrates and introduce new frontend software products from Ucamco, a CIMS group company.
These products represent the next generation of pre-CAM and full CAM solutions, as well as highly advanced material handling automation solutions for all segments of the PCB industry.
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