Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
All Flex Solutions Invests in Assembly Inspection Automation
October 17, 2024 | All Flex SolutionsEstimated reading time: 1 minute
All Flex has acquired an Omron VP9000 3D Solder Paste Inspection System and an Omron VT-S1080 3D Automatic Optical Inspection System for their flexible circuit assembly facility in Bloomington, Minnesota. These acquisitions are one part of All Flex Solutions’ four-year SMT Roadmap to expand the scale and capability of their assembly operations.
The VP9000 3D Solder Paste Inspection System reviews the solder paste deposit directly after printing, and solder prior to component placement. The VT-S1080 3D Automatic Optical Inspection System (AOI) reviews the reflowed solder deposit after assembly of components to the board. The VT-S1080 can also inspect slightly underneath the components to get a more complete picture of the reflowed solder filet.
The two systems work together to provide continuous closed loop data communication to optimize the solder paste printing operation for continuous, real time process improvement during manufacturing. The two machines work together to provide the ideal solder filet for assembly, providing quantitative inspection that conforms to international standards.
Both systems use advanced vision systems to accurately measure solder features, eliminating image noise such as component shadows, solder reflections and warpage in the PCB’s themselves.
These two additions will help optimize our solder printing profiles to match the components, and their surface mount lands, moving us to zero defects in our assembly operation. Assembling flexible circuits, flexible heaters and rigid flex circuits can present challenges. The boards are not always flat and planar and can often move quite a bit prior to, during and after assembly. This technology will improve our manufacturing consistency and yields in assembly.
The assembly side of the business has grown over the years, and so too has the complexity of today’s electronic assemblies, creating an environment where continuous improvement is critical for high manufacturing yields.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.