The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
Smart Automation: AI—Revolutionizing Inspection in Electronics Manufacturing
Standard of Excellence: The Role of Technology in Enhancing the Customer Experience
AIM to Present on High Reliability and Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA South China Expo & Tech Forum
October 18, 2024 | AIMEstimated reading time: 1 minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA South China Expo & Tech Forum taking place November 6-7 at the Shenzhen World Exhibition & Convention Center in Shenzhen, China. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.
NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.
In addition, AIM Product Manager, Diego Jiang will be giving a presentation titled High Reliability: The Challenges of Soldering for Extremely Harsh Environments:
High reliability in electronics pertains to the quality of solder joints themselves as well as the electrochemical properties of the flux residue. Key characteristics of reliable solder joints include strength and ductility. These joints are often tested via thermal cycling, drop shock and more. Exact testing requirements are dependent on application. When it comes to flux, industry standards such as IPC and JIS define the electrochemical requirements of flux residues, which is particularly important in no clean processes. This presentation outlines the trends and challenges of high reliability application sin automotive, military & aerospace, and LED sectors. Test data comparing specially formulated high reliability alloys with SAC305 are presented along with a discussion of how key elements of the alloys aid in improved reliability.
To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA South China Expo & Tech Forum November 6-7.
Share on:
Suggested Items
Altus Supports Phoenix Systems in Advancing THT Assembly with Robotic Soldering
05/27/2025 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, has successfully supported Phoenix Systems UK Ltd in its investment in robotic soldering technology to further enhance its through-hole technology (THT) assembly processes.
Advancements in High-reliability Alloys for Automotive and High-performance Applications
05/22/2025 | Barry Matties, I-Connect007At IPC APEX EXPO, MacDermid Alpha Electronic Solutions showcased its latest innovations in SMT assembly materials designed to meet the growing demands for reliability and sustainability in automotive and high-performance applications. In this interview, Ebad Rehman, business product manager, discusses the evolution of high-reliability alloys, spotlighting ALPHA Innolot, a proven solution developed in response to the automotive industry’s increasing expectations for durability and performance under harsh operating conditions.
KYZEN to Focus on Aqueous Cleaning and Stencil Cleaning at SMTA Juarez
05/20/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Juarez Expo and Tech Forum, scheduled to take place Thursday, June 5 at the Injectronics Convention Center in Ciudad Jarez, Chihuahua.
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.