Dan’s Biz Bookshelf: ‘The New Age of Innovation’
It’s Only Common Sense: The Customer Isn’t Always Right
The Marketing Minute: Building Connections in the Electronics Industry
FIT Hon Teng Showcases AI Data Center Connectivity and Immersion-Cooled Signal Integrity Solutions at OCP Global Summit 2024
October 21, 2024 | FoxconnEstimated reading time: 1 minute
FIT Hon Teng, a subsidiary of Hon Hai Precision Industry, will unveil its latest advancements in AI data center connectivity and immersion-cooling technologies at the upcoming 2024 OCP Global Summit. Hosted by the Open Compute Project (OCP), this prestigious event brings together global leaders in hardware infrastructure design, addressing the evolving demands of modern data centers.
At the summit, FIT will introduce solutions that tackle critical challenges in AI-driven data centers, including signal degradation, heat dissipation, and large-scale manufacturing scalability. FIT’s AI rack connectivity innovations are designed to enhance signal integrity and optimize data transmission, all while incorporating advanced cooling technologies for high-density AI workloads.
Key product highlights include:
- 224G+ sockets for XPU/GPU connectivity
- Co-packaged copper and optical architectures
- Power cables for ORV3
- Active Optical Cables (AOC)
- OSFP1600 and QSFP-DD port configurations
These solutions underscore FIT’s commitment to driving innovation in the AI data center space, building on Foxconn’s extensive industrial internet expertise to offer cutting-edge AI connectivity solutions to global data center customers.
In addition to its AI connectivity offerings, FIT will present its immersion-cooled IT platform solutions at the summit. Terry Little, Development Engineering Manager at FIT, will lead a session titled “Optimizing Signal Integrity in Immersion-Cooled IT Platforms.” The session will delve into the effects of dielectric fluids on high-speed signal lines, the challenges of high-speed testing in such environments, and innovative connector fixture strategies. These solutions are critical for ensuring reliable performance in harsh, high-density computing environments, such as AI data centers.
By addressing key issues such as performance, efficiency, and scalability, FIT continues to play a pivotal role in supporting the growth of AI infrastructure across industries, further solidifying its leadership in AI data center solutions.
Share on:
Suggested Items
NovoLINC Secures Investments to Assist AI Computing with Groundbreaking Thermal Interface Technology
01/21/2025 | PRNewswireNovoLINC, a thermal technology startup spun out of Carnegie Mellon University, announced seed funding led by M Ventures, with participation from Foothill Ventures and TDK Ventures. NovoLINC's breakthrough nanocomposite thermal solutions reduce thermal resistance to an industry-record low (< 1mm²-K/W), according to company co-founders, CSO Prof. Sheng Shen and CTO Dr. Rui Cheng.
Beyond Design: Electro-optical Circuit Boards
01/22/2025 | Barry Olney -- Column: Beyond DesignPredicting the role of PCB designers in 10 years is a challenge. If only I had a crystal ball. However, we know that as technology progresses, the limitations of copper PCBs are increasingly apparent, particularly regarding speed, bandwidth, and signal integrity. Innovations such as optical interconnects and photonic integrated circuits are setting the stage for the next generation of PCBs, delivering higher performance and efficiency. The future of PCB design will probably incorporate these new technologies to address the challenges of traditional copper-based designs.
BAE Systems Awarded $85M Contract to Deliver Network Tactical Common Data Links to the U.S. Navy
01/15/2025 | BAE SystemsIn 2024, the U.S. Navy awarded BAE Systems an $85 million production contract to deliver additional Network Tactical Common Data Link (NTCDL) systems.
SK Telecom, SK hynix and Penguin Solutions Sign Collaboration Agreement for AI Data Center Solutions
01/14/2025 | SK TelecomSK Telecom announced that it has signed a collaboration agreement with SK hynix and Penguin Solutions to pursue joint research, development, and business promotion of artificial intelligence data center (AIDC) solutions.
SAMI-AEC Showcases Cutting-Edge Technological Solutions at IKTVA 2025
01/13/2025 | SAMISAMI Advanced Electronics Company (SAMI-AEC), a subsidiary of SAMI, is proud to announce its participation in the “IKTVA Forum and Exhibition 2025,” the region’s leading event for energy sector supply chains.