-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIt's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
FIT Hon Teng Showcases AI Data Center Connectivity and Immersion-Cooled Signal Integrity Solutions at OCP Global Summit 2024
October 21, 2024 | FoxconnEstimated reading time: 1 minute
FIT Hon Teng, a subsidiary of Hon Hai Precision Industry, will unveil its latest advancements in AI data center connectivity and immersion-cooling technologies at the upcoming 2024 OCP Global Summit. Hosted by the Open Compute Project (OCP), this prestigious event brings together global leaders in hardware infrastructure design, addressing the evolving demands of modern data centers.
At the summit, FIT will introduce solutions that tackle critical challenges in AI-driven data centers, including signal degradation, heat dissipation, and large-scale manufacturing scalability. FIT’s AI rack connectivity innovations are designed to enhance signal integrity and optimize data transmission, all while incorporating advanced cooling technologies for high-density AI workloads.
Key product highlights include:
- 224G+ sockets for XPU/GPU connectivity
- Co-packaged copper and optical architectures
- Power cables for ORV3
- Active Optical Cables (AOC)
- OSFP1600 and QSFP-DD port configurations
These solutions underscore FIT’s commitment to driving innovation in the AI data center space, building on Foxconn’s extensive industrial internet expertise to offer cutting-edge AI connectivity solutions to global data center customers.
In addition to its AI connectivity offerings, FIT will present its immersion-cooled IT platform solutions at the summit. Terry Little, Development Engineering Manager at FIT, will lead a session titled “Optimizing Signal Integrity in Immersion-Cooled IT Platforms.” The session will delve into the effects of dielectric fluids on high-speed signal lines, the challenges of high-speed testing in such environments, and innovative connector fixture strategies. These solutions are critical for ensuring reliable performance in harsh, high-density computing environments, such as AI data centers.
By addressing key issues such as performance, efficiency, and scalability, FIT continues to play a pivotal role in supporting the growth of AI infrastructure across industries, further solidifying its leadership in AI data center solutions.
Suggested Items
Accenture Invests in Voltron Data to Help Organizations Use GPU Technology to Simplify Large-Scale Data Processing
02/21/2025 | BUSINESS WIREAccenture announced an investment in Voltron Data, a company that is building software to unlock the next generation of accelerated computing that underpins modern AI applications. This investment, made through Accenture Ventures, will support Voltron Data in its efforts to help organizations use advanced computing technology to speed up large-scale analytics, used for generative AI and machine learning applications.
STMicroelectronics to Enable Higher-Performance Cloud Optical Interconnect in Datacenters and AI Clusters
02/20/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, is unveiling its next generation of proprietary technologies for higher-performing optical interconnect in datacenters and AI clusters.
Revolutionizing Supply Chain: The Cofactr Solution
02/19/2025 | Marcy LaRont, I-Connect007Cofactr was co-founded by Phillip Gulley and Matthew Haber, originally as a small PCB assembly house. Recognizing a greater need, they transformed Cofactr into a supply chain execution platform that automates and optimizes manufacturing processes. The company integrates early design data with supply chain information to identify potential issues, provide risk abatement, and streamline procurement. I met with Phillip at DesignCon and asked him to walk me through the company’s background. He explained how Cofactr helps companies ensure compliance and achieve efficient material management, allowing engineering teams to focus on design rather than logistics.
Altair Releases Altair HyperWorks 2025
02/19/2025 | AltairAltair, a global leader in computational intelligence, is thrilled to announce the release of Altair® HyperWorks® 2025, a best-in-class design and simulation platform for solving the world's most complex engineering challenges.
Fresh PCB Concepts: Traceability in PCB Design
02/20/2025 | Team NCAB -- Column: Fresh PCB ConceptsTraceability has evolved from a safety-critical need in PCB production to a valuable tool across all electronic manufacturing industry sectors. The IPC-1782 standard addresses automated data collection, reduces ownership costs, and ensures accurate, timely information. It provides a flexible data architecture for different levels of traceability, from highly detailed systems (e.g., critical safety systems) to basic traceability needs (e.g., consumer products). The structure avoids data duplication and allows crucial information to be added post-production.