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FIT Hon Teng Showcases AI Data Center Connectivity and Immersion-Cooled Signal Integrity Solutions at OCP Global Summit 2024
October 21, 2024 | FoxconnEstimated reading time: 1 minute
FIT Hon Teng, a subsidiary of Hon Hai Precision Industry, will unveil its latest advancements in AI data center connectivity and immersion-cooling technologies at the upcoming 2024 OCP Global Summit. Hosted by the Open Compute Project (OCP), this prestigious event brings together global leaders in hardware infrastructure design, addressing the evolving demands of modern data centers.
At the summit, FIT will introduce solutions that tackle critical challenges in AI-driven data centers, including signal degradation, heat dissipation, and large-scale manufacturing scalability. FIT’s AI rack connectivity innovations are designed to enhance signal integrity and optimize data transmission, all while incorporating advanced cooling technologies for high-density AI workloads.
Key product highlights include:
- 224G+ sockets for XPU/GPU connectivity
- Co-packaged copper and optical architectures
- Power cables for ORV3
- Active Optical Cables (AOC)
- OSFP1600 and QSFP-DD port configurations
These solutions underscore FIT’s commitment to driving innovation in the AI data center space, building on Foxconn’s extensive industrial internet expertise to offer cutting-edge AI connectivity solutions to global data center customers.
In addition to its AI connectivity offerings, FIT will present its immersion-cooled IT platform solutions at the summit. Terry Little, Development Engineering Manager at FIT, will lead a session titled “Optimizing Signal Integrity in Immersion-Cooled IT Platforms.” The session will delve into the effects of dielectric fluids on high-speed signal lines, the challenges of high-speed testing in such environments, and innovative connector fixture strategies. These solutions are critical for ensuring reliable performance in harsh, high-density computing environments, such as AI data centers.
By addressing key issues such as performance, efficiency, and scalability, FIT continues to play a pivotal role in supporting the growth of AI infrastructure across industries, further solidifying its leadership in AI data center solutions.
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Rachael Temple - AlltematedSuggested Items
Brent Laufenberg Appointed CIO of the Global Electronics Association, Advancing Technology and Member Services
07/31/2025 | Global Electronics AssociationThe Global Electronics Association (formerly IPC International Inc.) announces the appointment of Brent Laufenberg as its new Chief Information Officer (CIO).
SES AI Accelerates Timeline for Revenue Growth and Profitability with Acquisition of UZ Energy
07/31/2025 | BUSINESS WIRESES AI Corporation, a global leader in the development and manufacturing of AI-enhanced high-performance Li-Metal and Li-ion batteries, today announced it has executed a definitive agreement to acquire 100% of UZ Energy, an energy storage systems (“ESS”) provider, for a purchase price of approximately $25.5 million, subject to earnout adjustment based on the achievement of specified financial targets.
Teramount Raises $50M to Address Growing Demand for AI Infrastructure Optical Connectivity
07/31/2025 | PRNewswireTeramount, the leader in scalable fiber-to-chip interconnect solutions for AI, data centers and advanced computing, today announced it has raised $50 million in financing led by new investor Koch Disruptive Technologies (KDT). Existing investors Grove Ventures and several new strategic investors, including AMD Ventures, Hitachi Ventures, Samsung Catalyst Fund and Wistron, joined the round.
Hon Hai Technology Group (Foxconn) and TECO Announce Strategic Alliance Targeting AI Data Center Capabilities
07/31/2025 | Hon Hai Technology GroupHon Hai Technology Group (“Foxconn”) and TECO Electric & Machinery Co Ltd (“TECO”) on Wednesday announced a share exchange, strategic alliance that will strengthen their AI infrastructure capabilities and propel the two Taiwanese tech majors into key markets in the global super-computing race.
Leveraging Chemical Data More Efficiently
07/29/2025 | Lynn L. Bergeson, Bergeson & CampbellSome truths transcend politics, one being that chemical data holds enduring value and is becoming increasingly essential. In the United States, regardless of which party federally controls the levers of power, it’s clear that chemical manufacturers and their customers must develop and curate robust data portfolios for their chemical inventories. The commercial imperatives driving this are undeniable and gaining traction.