Dan's Biz Bookshelf: 'Getting Naked: A Business Fable'
The Chemical Connection: Common Misconceptions in Wet Processing
It’s Only Common Sense: Selling to Engineers
FIT Hon Teng Showcases AI Data Center Connectivity and Immersion-Cooled Signal Integrity Solutions at OCP Global Summit 2024
October 21, 2024 | FoxconnEstimated reading time: 1 minute
FIT Hon Teng, a subsidiary of Hon Hai Precision Industry, will unveil its latest advancements in AI data center connectivity and immersion-cooling technologies at the upcoming 2024 OCP Global Summit. Hosted by the Open Compute Project (OCP), this prestigious event brings together global leaders in hardware infrastructure design, addressing the evolving demands of modern data centers.
At the summit, FIT will introduce solutions that tackle critical challenges in AI-driven data centers, including signal degradation, heat dissipation, and large-scale manufacturing scalability. FIT’s AI rack connectivity innovations are designed to enhance signal integrity and optimize data transmission, all while incorporating advanced cooling technologies for high-density AI workloads.
Key product highlights include:
- 224G+ sockets for XPU/GPU connectivity
- Co-packaged copper and optical architectures
- Power cables for ORV3
- Active Optical Cables (AOC)
- OSFP1600 and QSFP-DD port configurations
These solutions underscore FIT’s commitment to driving innovation in the AI data center space, building on Foxconn’s extensive industrial internet expertise to offer cutting-edge AI connectivity solutions to global data center customers.
In addition to its AI connectivity offerings, FIT will present its immersion-cooled IT platform solutions at the summit. Terry Little, Development Engineering Manager at FIT, will lead a session titled “Optimizing Signal Integrity in Immersion-Cooled IT Platforms.” The session will delve into the effects of dielectric fluids on high-speed signal lines, the challenges of high-speed testing in such environments, and innovative connector fixture strategies. These solutions are critical for ensuring reliable performance in harsh, high-density computing environments, such as AI data centers.
By addressing key issues such as performance, efficiency, and scalability, FIT continues to play a pivotal role in supporting the growth of AI infrastructure across industries, further solidifying its leadership in AI data center solutions.
Share on:
Suggested Items
New Database of Materials Accelerates Electronics Innovation
05/02/2025 | ACN NewswireIn a collaboration between Murata Manufacturing Co., Ltd., and the National Institute for Materials Science (NIMS), researchers have built a comprehensive new database of dielectric material properties curated from thousands of scientific papers.
IT Distribution Records Strong Revenue Growth in Q1 Fueled by Personal Computing Purchases Amidst Tariff Uncertainty
05/02/2025 | IDCSales through distribution in North America posted a second consecutive quarter of growth in the first quarter of 2025. Distributor Revenues came in at $19.9B which is a 7.6% increase year-over-year, according to the International Data Corporation (IDC) North America Distribution Track e r (NADT).
INEMI Smart Manufacturing Tech Topic Series: Enhancing Yield and Quality with Explainable AI
05/02/2025 | iNEMIIn semiconductor manufacturing, the ability to analyze vast amounts of high-dimensional data is critical for ensuring product quality and optimizing wafer yield.
Nolan's Notes: The Next Killer App in Component Manufacturing
05/02/2025 | Nolan Johnson -- Column: Nolan's NotesFor quite a while, I’ve been wondering what the next “killer app” will be in electronics manufacturing and why it has been so long since the last disruptive change in EMS. I believe the answer lies in artificial intelligence, which has exploded as the next disruptor.
Keysight EDA, Intel Foundry Collaborate on EMIB-T Silicon Bridge Technology for Next-Generation AI and Data Center Solutions
04/30/2025 | BUSINESS WIREKeysight Technologies, Inc. announced a collaboration with Intel Foundry to support Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology, a cutting-edge innovation aimed at improving high-performance packaging solutions for artificial intelligence (AI) and data center markets in addition to the support of Intel 18A process node.