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Indium Expert to Present AI Packaging and High-Power Consumption Solutions at SEMICON Taiwan

08/31/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Jason Chou will discuss solutions designed to address the high-power consumption and complex packaging challenges of AI applications, from integrated circuits to full system assembly, at SEMICON Taiwan, September 2-4, in Taipei, Taiwan.

Infineon, Tack One Win SICC Award for Best Technological Collaboration

08/31/2026 | Infineon
Infineon Technologies Asia Pacific Pte Ltd and Tack One Pte Ltd have been recognized by Singapore International Chamber of Commerce (SICC)  as the winner of the “Best Technological Collaboration” category and as a finalist in the “Most Sustainable Collaboration” category at the 2026 SICC Awards ceremony, for their partnership in developing FloodFinder™, a smart urban flood monitoring system.

Qnity Introduces Stackplane CMP Slurry Platform for Advanced Packaging

08/31/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, has further expanded its offerings for advanced packaging with the introduction of the Stackplane™ family of slurries for chemical mechanical planarization (CMP).

Element Solutions, Solstice Advanced Materials End Merger Agreement

08/28/2026 | BUSINESS WIRE
Element Solutions Inc, a global and diversified specialty chemicals technology company, announced that the merger agreement between Element Solutions and Solstice Advanced Materials Inc. has been mutually terminated.

Viscom Inc. to Showcase Latest AI-Powered Inspection Solutions at SMTA Mexico 2026

08/27/2026 | Viscom Inc.
Viscom Inc., will present its latest AI-powered inspection solutions at SMTA Mexico 2026, taking place from October 7–8 at the Expo Guadalajara Salón Jalisco.
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