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TI DLP® Technology Delivers High-Precision Digital Lithography for Advanced Packaging

10/02/2025 | Texas Instruments
Texas Instruments is enhancing the next generation of digital lithography with the introduction of the DLP991UUV digital micromirror device (DMD), the company’s highest resolution direct imaging solution to date.

Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages

10/01/2025 | I-Connect007
I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.

Highlights from the IMAPS Onshoring Advanced Packaging Workshop in Washington, D.C.

09/30/2025 | Marcy LaRont, I-Connect007
IMAPS and the Global Electronics Association co-hosted the Onshoring Advanced Packaging and Assembly Workshop in Washington, D.C., in early September. Government leaders, including those from the Department of Defense, attended and were directly involved in organizing the content of the sessions. Jim Will, director of the U.S. Partnership for Assured Electronics, speaks about his role in the event.

SCHMID Advances Next-Gen Advanced Packaging with New InfinityLine and Glass Core Substrate Solutions

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Siemens, ASE Collaborate on Workflows for ASE’s VIPack Advanced Packaging Platform

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Siemens Digital Industries Software announced that it is collaborating with Advanced Semiconductor Engineering, Inc. (ASE), the leading global provider of semiconductor manufacturing services in assembly and test, to develop 3Dblox-based workflows for the ASE VIPack™ platform using Siemens’ Innovator3D IC™ solution, which is fully certified for the 3Dblox standard..   
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