-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAlternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
Wet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Koh Young Technology Showcasing its Inspection Solutions at electronica and SEMICON Europa
October 22, 2024 | Koh Young TechnologyEstimated reading time: 2 minutes
Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions at Messe München on November 12-15, 2024. At electronica Booth A3.358, our team of experts will be on hand to discuss how our AOI, SPI and DPI solutions boost your quality and increase your yield. At the parallel event SEMICON Europa Booth C2.549, our application engineering team will be showcasing our superior quality semiconductor inspection solutions for advanced and wafer-level packaging.
For PCB Assembly Professionals: electronica Booth A3.358
At electronica Booth A3.358, Koh Young’s experts will demonstrate how our Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and Dispensed Material Inspection (DPI) solutions can enhance your production quality and yield. There we will be highlighting three systems uniquely positioned to provide solutions for your challenges:
Zenith Alpha A cutting-edge True 3D AOI solution driven by artificial intelligence and machine learning. The Zenith Alpha integrates advanced mechatronics and algorithms to deliver top-tier performance without sacrificing accuracy.
KY8030-2 As the best-selling True 3D Solder Paste Inspection system, the KY8030-2 features Koh Young’s patented dual-inspection Moiré projection technology, overcoming the challenges of shadow and specular reflection other systems cannot.
Neptune C+ Protect your electronics with confidence. Koh Young’s L.I.F.T. technology (Laser Interferometry for Fluid Tomography) ensures precise, non-destructive 3D inspection of conformal coatings, whether wet or dry.
For Semiconductor Professionals: SEMICON Europa Booth C2.549
Meanwhile, at SEMICON Europa Booth C2.549, we will showcase inspection technologies specifically designed for semiconductor and advanced packaging applications, including wafer-level packaging solutions. Our team of inspection experts will highlight three different machines, including:
Meister S Qualified by leading semiconductor foundries and Mini/Micro-LED companies, the Meister S delivers full 3D inspection for micro solder and flux inspection applications, combining high-resolution optics with innovative vision algorithms.
Meister D This system offers high-speed 3D inspection of both small components like MLCCs and silicon die. Powered by advanced optics and AI-driven defect analysis, the Meister D detects microcracks, chipping, foreign materials, and more.
Meister D+ Breakthrough True 3D inspection technology for high-density substrates and highly reflective components. The Meister D+ leverages Koh Young’s new proprietary optics and Moiré technology to achieve accurate 3D inspection of mirror-finish reflective dies and challenging surfaces.
Visit Us and Elevate Your Inspection Capabilities
For more information about how Koh Young’s award-winning solutions can elevate your production quality and solve your most challenging inspection needs, visit us at electronica Booth A3.358 or SEMICON Europa Booth C2.549. Do not miss this opportunity to engage with our experts, experience our innovative technologies firsthand, and discover how we can help you achieve new levels of efficiency in your manufacturing processes.
Suggested Items
TRI to Exhibit Test and Inspection Solutions at SMTA Tijuana Expo
10/21/2024 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, will be participating in the SMTA Tijuana Expo & Tech Forum 2024 at the Quartz Hotel Tijuana, Tijuana, Baja California, Mexico on November 7, 2024.
TRI Launches High-Speed 3D AXI for Semiconductor Applications
10/18/2024 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, proudly announces the release of the high-throughput 3D SEMI CT AXI TR7600 SIII Plus, specifically designed for high-reliability electronics manufacturing, including the Semiconductor and Advanced Packaging industries.
All Flex Solutions Invests in Assembly Inspection Automation
10/17/2024 | All Flex SolutionsAll Flex has acquired an Omron VP9000 3D Solder Paste Inspection System and an Omron VT-S1080 3D Automatic Optical Inspection System for their flexible circuit assembly facility in Bloomington, Minnesota. These acquisitions are one part of All Flex Solutions’ four-year SMT Roadmap to expand the scale and capability of their assembly operations.
CIMS to Showcase Advanced Solutions at TPCA 2024
10/17/2024 | CIMSCIMS, a leading provider of inspection solutions for the electronics manufacturing industry, will be exhibiting at the Taiwan Printed Circuit Association (TPCA) 2024 exhibition in Taipei from October 23-25.
Saki Strengthens Presence in India
10/17/2024 | Saki CorporationSaki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce its sales partnership agreement with Blue Star Engineering & Electronics Ltd. (Blue Star E&E) for the Indian market.