-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Koh Young Invites You to the 2025 IEEE Electronic Components and Technology Conference
May 6, 2025 | Koh YoungEstimated reading time: 1 minute

Koh Young, the industry leader in True3D™ measurement-based inspection solutions, invites you to join us at the 2025 IEEE Electronic Components and Technology Conference (ECTC), taking place May 27–30, 2025, at the Gaylord Texan Resort & Convention Center in Grapevine, Texas. Now in its 75th year, ECTC is the premier international event dedicated to microelectronic packaging, components, and systems, bringing together global experts for collaboration, education, and innovation.
As the exclusive sponsor of the ECTC Gala, Koh Young is proud to continue its commitment to the advanced packaging community. The 2025 technical program features groundbreaking work in assembly and manufacturing technologies, heterogeneous integration, wafer-level packaging, and semiconductor inspection. Attendees will gain insights from industry leaders through technical sessions, panels, plenaries, and EPS seminars, as well as in the exhibition area.
The ECTC Exhibition offers a vital opportunity for engineers, technologists, and decision makers to engage directly with Koh Young and other technology leaders. Visit booth 419 to learn how our AI-powered 3D inspection solutions are solving critical challenges in advanced packaging and semiconductor applications. Our experts will be on hand to discuss how True 3D measurement and automated process control are helping manufacturers improve quality, reduce waste, and achieve zero-defect production goals.
“As advanced packaging and semiconductor technologies continue to push the limits of precision and reliability, manufacturers need inspection solutions that can keep pace,” said Brent Fischthal, Head of Global Marketing at Koh Young. “At ECTC 2025, we’re excited to connect with engineers and decision makers to explore how our AI-powered 3D metrology solutions enable smarter process control and higher yield. We're also pleased to introduce our new sales partner, NTV USA, who will help us expand support for customers in these critical application areas.”
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Curtiss-Wright to Supply Turret Drive Stabilization Systems for U.S. Army XM30 Combat Vehicle Prototypes
10/16/2025 | BUSINESS WIRECurtiss-Wright Corporation announced that it has been selected by American Rheinmetall to provide its Turret Drive Stabilization System (TDSS) for the prototype phase of the U.S. Army’s XM30 Combat Vehicle (CV) program, which was recently approved to advance to Milestone B, the Engineering and Manufacturing Development (EMD) phase.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
American Standard Circuits Achieves Successful AS9100 Recertification
10/14/2025 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading manufacturer of advanced printed circuit boards, proudly announces the successful completion of its AS9100 recertification audit. This milestone reaffirms ASC’s ongoing commitment to the highest levels of quality, reliability, and process control required to serve aerospace, defense, space, and other mission-critical industries.
Imec Launches 300mm GaN Program to Develop Advanced Power Devices and Reduce Manufacturing Costs
10/13/2025 | ImecImec, a world-leading research and innovation hub in nanoelectronics and digital technologies, welcomes AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco as first partners in its 300mm gallium-nitride (GaN) open innovation program track for low- and high-voltage power electronics applications.
Renesas Powers 800 Volt Direct Current AI Data Center Architecture with Next-Generation Power Semiconductors
10/13/2025 | RenesasRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that it is supporting efficient power conversion and distribution for the 800 Volt Direct Current power architecture announced by NVIDIA, helping fuel the next wave of smarter, faster AI infrastructure.