Dan’s Biz Bookshelf: Four Important Books You Need to Read (Not Just Say You Have)
Marcy’s Musings: Advancing the Advanced Materials Discussion
The Marketing Minute: Cracking the Code of Technical Marketing
American Standard/Sunstone Circuits to Exhibit at the Northwest Electronics Design & Manufacturing Expo (NEDME) 2024
October 22, 2024 | ASC SunstoneEstimated reading time: 1 minute
ASC Sunstone Circuits is excited to announce that we will be exhibiting at the upcoming Northwest Electronics Design & Manufacturing Expo (NEDME) on Wednesday, October 30, 2024. This premier event, hosted at the Wingspan Event & Conference Center in Hillsboro, Oregon, offers a full day of innovation, collaboration, and insights for professionals in the electronics design and manufacturing industry.
As one of the largest events in the region dedicated to advancing electronics manufacturing, NEDME provides an excellent opportunity for you to connect with industry leaders, suppliers, and innovators shaping the future of electronics design and production. Whether you’re involved in PCB design, product development, material sourcing, or manufacturing operations, NEDME is the place to discover new trends, technologies, and solutions.
What to Expect at NEDME 2024:
- Exhibit Hall: Explore cutting-edge products and services from industry-leading vendors showcasing the latest in electronics design and manufacturing solutions.
- Keynote Speakers: Hear from top thought leaders who will share insights on emerging trends, industry challenges, and opportunities.
- Technical Sessions & Workshops: Attend informative sessions spanning design, manufacturing, and business topics to stay up to date with the latest industry advancements.
- Networking Opportunities: Connect with peers, potential partners, and experts throughout the day to foster collaboration and build valuable relationships.
Event Details:
- Date: Wednesday, October 30, 2024
- Time: 9:00 AM – 4:00 PM
- Location: Wingspan Event & Conference Center, 801 NE 34th Ave, Hillsboro, OR 97124
Don't miss out on this chance to engage with the electronics community and see what ASC Sunstone has to offer. Register now at www.nedme.com to secure your spot, and be sure to stop by our booth!
We look forward to seeing you there!
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
A.R.T. Invests in Latest Equipment to Further Enhance Electronics Training Facilities
09/17/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, has announced a series of new equipment investments at its state-of-the-art training centre.
Richardson Electronics Appoints Daniel Albers to Drive Made-in-USA Contract Manufacturing Expansion
09/17/2025 | Globe NewswireRichardson Electronics, Ltd., a global provider of engineered solutions for the green energy, power management, and custom display markets, announced the appointment of Daniel Albers to spearhead business development for its expanded, Made-in-USA contract manufacturing efforts.
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.