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Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
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iNEMI Connector Footprint Tolerance End-of-Project Webinar
October 24, 2024 | iNEMIEstimated reading time: Less than a minute
iNEMI’s PCB Connector Footprint Tolerance Project investigated industry capability, risks and mitigation strategies associated with high-bandwidth I/O connector footprints. As bandwidth continues to double every three years, the reduction in connector pitch imposes stringent design requirements on PCB fabrication processes. The project team aimed to provide product designers with the information necessary to ensure predictable quality levels when using high-bandwidth connectors. A literature review, along with team experience, helped identify potential risks and create a PCB industry survey to assess supplier capabilities for appropriate quality mitigation.
Join us for this end-of-project webinar where we will review survey results and highlight areas of expectations and gaps between PCB fabricators and connector manufacturers. Additionally, the team will present recommendations for quality assessment and dimension control.
Registration
This webinar is open to industry; advance registration is required, click here.
Monday, October 28, 2024
11:00 a.m. – 12:00 p.m. EDT (Americas)
4:00-5:00 p.m. CET (Europe)
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Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
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