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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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iNEMI Connector Footprint Tolerance End-of-Project Webinar
October 24, 2024 | iNEMIEstimated reading time: Less than a minute
iNEMI’s PCB Connector Footprint Tolerance Project investigated industry capability, risks and mitigation strategies associated with high-bandwidth I/O connector footprints. As bandwidth continues to double every three years, the reduction in connector pitch imposes stringent design requirements on PCB fabrication processes. The project team aimed to provide product designers with the information necessary to ensure predictable quality levels when using high-bandwidth connectors. A literature review, along with team experience, helped identify potential risks and create a PCB industry survey to assess supplier capabilities for appropriate quality mitigation.
Join us for this end-of-project webinar where we will review survey results and highlight areas of expectations and gaps between PCB fabricators and connector manufacturers. Additionally, the team will present recommendations for quality assessment and dimension control.
Registration
This webinar is open to industry; advance registration is required, click here.
Monday, October 28, 2024
11:00 a.m. – 12:00 p.m. EDT (Americas)
4:00-5:00 p.m. CET (Europe)
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Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”