SP Manufacturing Celebrates Grand Opening of New Factory in Senai, Malaysia
October 29, 2024 | SP ManufacturingEstimated reading time: 1 minute
SP Manufacturing Pte Ltd., a leader in comprehensive electronic manufacturing services, is thrilled to announce the grand opening of its new factory in Senai, Malaysia, marking a significant milestone in the company’s journey. This state-of-the-art facility enhances the company’s operational resilience and positions SP Manufacturing to meet growing customer demand in the region.
The new factory reflects SP Manufacturing’s ongoing mission to deliver high-quality and timely service across all operations. It will complement SPM’s existing global facilities, providing the same level of excellence that customers have come to expect.
"This achievement is a testament to the hard work and dedication of our entire team," said Jackson Tan, Global Business Development Director at SP Manufacturing. "We look forward to writing the next chapter of the SPM story as we continue to grow, innovate and deliver unmatched value to our customers."
The Senai facility is equipped with comprehensive manufacturing capabilities, including:
- Advanced electrical and functional testing
- In-circuit testing and automated optical inspection (AOI)
- State-of-the-art cleaning processes
- Rigorous inspection protocols
- Rapid prototyping and expert assembly processes
In addition to these technical capabilities, SP Manufacturing excels in supply chain management, ensuring the timely delivery of high-quality components and seamless support for its customers.
SP Manufacturing serves a broad range of industries, including Medical Devices, Mission Critical, Automotive, Aerospace and Defense, Industrial Equipment, Telecommunications, and Renewable Energy. This diverse market reach reflects the company’s ability to adapt and meet the unique needs of a variety of industries.
Suggested Items
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and GlobalFoundries.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.