Dan’s Biz Bookshelf: ‘Costovation: Innovation That Gives Your Customers Exactly What They Want—And Nothing More’
The Right Approach: ‘Twas the Night Before Christmas (Harley-style)
It’s Only Common Sense: Dear Santa, Here’s My Sales Wish List
Siemens, CELUS Collaborate to Empower SMBs with AI-powered PCB Design
October 30, 2024 | SiemensEstimated reading time: 2 minutes
Siemens Digital Industries Software, a global leader in PCB electronic systems design, and CELUS, a pioneer in AI-powered electronic design automation solutions, announced their collaboration to transform the PCB design landscape for small and medium-sized businesses (SMBs) and independent engineers.
This collaboration combines Siemens’ industry-leading PCB design expertise with CELUS' innovative AI automation platform to create a powerful, user-friendly and cost-effective solution tailored to the real-world needs of engineers. The integration of CELUS’ AI-driven automation with Siemens’ next-generation PCB design solution aims to deliver a fully integrated design environment that accelerates design processes, minimizes errors and brings innovative products to market faster and more efficiently.
Empowering engineers with advanced, accessible tools
Engineers and SMBs often face challenges such as tight budgets, limited resources, and the need to juggle multiple roles. Siemens EDA and the CELUS Design Platform are jointly addressing these pain points by simplifying complex PCB design tasks and reducing the time spent on repetitive processes through intelligent automation.
“At Siemens EDA, our mission is to enable innovation and make advanced design tools accessible to businesses of all sizes,” said AJ Incorvaia, senior vice president, Electronic Board Systems, Siemens Digital Industries Software. “Collaborating with CELUS allows us to combine our proven PCB design solutions with front-end, cutting-edge AI automation, providing engineers with the tools they need to innovate efficiently and compete effectively in today's fast-paced market."
Streamlining PCB design with AI automation
CELUS' AI-powered platform automates routine design tasks, such as schematic generation and component selection, allowing engineers to focus on creativity and complex problem-solving. The integration with Siemens’ EDA tools ensures a seamless and flexible design experience, offering a new AI-powered block-level design interface.
"We are extremely excited to work with Siemens to bring our AI-driven automation to a wider audience," said Tobias Pohl, CEO of CELUS. "This collaboration is about empowering engineers by simplifying their workflows, reducing errors and making advanced PCB design more accessible. Together, we're leveling the playing field for SMBs and independent engineers."
Stay informed and visit Siemens at Electronica 2024
Engineers and businesses interested in learning more about the Siemens and CELUS collaboration and future solutions are invited to visit Siemens during Electronica 2024 in Munich from November 12-15, 2024. Engineers are invited to visit the Siemens EDA booth, Hall A3, Booth 561, where CELUS will host demo stations and deliver theatre presentations detailing how AI-driven automation can transform the PCB design process.
Share on:
Suggested Items
SP Manufacturing Expands with New Malaysia Plant, Acquires Ideal Jacobs
12/26/2024 | PRNewswireSP Manufacturing (SPM), a leader in Electronic Manufacturing Services (EMS), is strengthening its global presence with two major moves: opening a new manufacturing facility in Senai, Malaysia, and successfully acquiring Ideal Jacobs Corporation.
Robosys, ACUA Ocean + OREC Secure Funding For Collaborative Autonomy Project
12/25/2024 | RobosysAdvanced maritime autonomy developer, Robosys Automation, supported by USV manufacturer, ACUA Ocean, and Offshore Renewable Energy Catapult (OREC), have jointly secured grant funding through Innovate UK.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.