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Advanced Electronics Packaging Digest

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Suggested Items

H2 Core Systems Builds Scalable Hydrogen Energy Solutions with Siemens Xcelerator

05/18/2026 | Siemens
Siemens has announced that H2 Core Systems, a startup focused on modular hydrogen-based energy systems, is using the Siemens Xcelerator platform of software and automation portfolio to design and manufacture compact, highly efficient hydrogen energy systems that generate and store clean energy where it is needed.

AT&S Advances Glass Core Substrates for AI, HPC, and Photonics

04/22/2026 | AT&S
AT&S is advancing glass core substrates from research toward industrial use in artificial intelligence, high-performance computing, high-speed communications and photonics.

Intel, Dell Technologies and Nokia Redefine UPF Deployment at the Far Edge

04/21/2026 | Intel
Dell PowerEdge XR8000 with Intel® Xeon™ 6 SoC delivers high-performance UPF compute to rugged, space‑ and power‑constrained 5G edge environments.

Introducing FKN Systek Depanelizer with Linear Guide Table for Small PCBs

04/20/2026 | FKN Systek
Singulating small PCBs with circular blade depanelizers can be a tedious repetitive process which can easily result in board damage due to operator fatigue. Increase process quality and safety by using the FKN Systek K2010 motorized circular blade depanelizer with a support table to separate the V-Scored boards.

Henger Targets AI PCB Challenges With Advanced Plasma Technology

04/02/2026 | I-Connect007 Editorial Team
Henger is pushing the boundaries of PCB manufacturing with its dynamic, next-generation plasma technology, purpose-built for the demands of AI-driven electronics. As designs move toward higher density, faster speeds, and advanced materials like M9 laminates, Henger’s innovative plasma systems deliver precise, uniform, and energy-efficient processing. In this interview, company leaders, Zhiquang Li and Ping Tang discuss how their cutting-edge solutions are redefining cleaning, surface activation, and process control—positioning plasma technology as a critical enabler of reliability and performance in the rapidly evolving AI hardware landscape.
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