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U.S. Department of Commerce Announces CHIPS Incentives Awards with Corning, Edwards Vacuum, and Infinera

01/21/2025 | U.S. Department of Commerce
The U.S. Department of Commerce announced it finalized three separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

Rehm Thermal Systems Produces in New Clean Room

01/20/2025 | Rehm Thermal Systems
For the manufacture of many products, such as semiconductors, cleanrooms are a mandatory requirement for high quality and product safety, as even the smallest impurities can damage the product.

Department of Commerce Finalizes Long-Term Partnership with Natcast to Operate the National Semiconductor Technology Center

01/20/2025 | U.S. Department of Commerce
The U.S. Department of Commerce announced the National Institute of Standards and Technology (NIST) has awarded Natcast up to $6.3 billion to operate the National Semiconductor Technology Center (NSTC) under a long-term agreement with NIST.

SIA Applauds CHIPS Act Incentives for Infinera, Corning, Edwards Vacuum, and GlobalFoundries

01/20/2025 | SIA
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending a series of CHIPS and Science Act agreements announced by the U.S. Department of Commerce.

U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging

01/17/2025 | U.S. Department of Commerce
The U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing.
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