Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
iNEMI and MIT Conduct Survey on Optical Adhesives for High-Volume Photonics
January 21, 2025 | iNEMIEstimated reading time: Less than a minute
The International Electronics Manufacturing Initiative (iNEMI), in conjunction with MIT's FUTUR-IC initiative, is conducting a survey to understand the status of stakeholders, materials, applications, standards and test methods for high-volume deployment of optical adhesives for optoelectronics applications, particularly for silicon photonics and co-packaged optics.
Rapid adoption of applications such as artificial intelligence, high-performance computing and autonomous systems requires efficient, economical, and sustainable hardware solutions. This need is driving rapid developments in photonics and co-packaged optics. Advancements in materials, assembly processes, and test methods for optical adhesives are essential to achieve high-volume manufacturing, lower costs, and environmentally friendly solutions.
The Adhesives Characterization for Optical Packaging (ACOP) Project, a collaborative effort between INEMI and FUTUR-IC, aims to accelerate the development and adoption of economically and environmentally sustainable optical adhesive materials. To learn more about this project and the FUTUR-IC initiative, download the presentation from our December webinar.
Please Share Your Input — Take the Survey
Your participation in the iNEMI / MIT survey will contribute immensely to the progress of this project's goal. The survey is available online and will take approximately 10-20 minutes to complete. Deadline for input is Thursday, January 30, 2025.
Take the survey HERE.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
What EMS Firms Want From Their Software—and What They Get
09/03/2025 | Thiago Guimaraes, Global Electronics AssociationLast November, the Global Electronics Association [as IPC] surveyed EMS and OEM companies to better understand the software tools driving their operations and uncover trends in adoption, satisfaction, and challenges. The survey assessed software tools across critical functions, including ERP, MES, PLM, QMS, LMS, quoting systems, and CRM. Participants shared insights on tool adoption, satisfaction, and selection priorities.
ASMPT Earns Global Recognition for Outstanding Customer Service in 2025 TechInsights Survey
07/31/2025 |ASMPT has been recognised for excellence in the 2025 TechInsights Global Semiconductor Supplier Survey for the 12th consecutive year. This year, it was ranked third for excellence in customer service among large equipment suppliers.
IDC Introduces the Enterprise PC Trust Perception Index
05/21/2025 | IDCThe Enterprise PC Trust Index, International Data Corporation’s (IDC) first independent study of PC vendors in the trust space, was issued.
DroneDeploy, GEODNET Foundation Announce Partnership to Provide Enterprise RTK Services for Drone-based Reality Capture
02/27/2025 | BUSINESS WIREDroneDeploy, the leading aerial and ground reality capture and robotics platform, announces the signing of a partnership agreement with the GEODNET Foundation, the world’s largest precise location Real-Time Kinematics (RTK) network.
European EMS Market Experiences Double Digit Negative Growth in 2024, But May Experience Slight Positive Growth in 2025
02/27/2025 | IPCAs revealed this week by an annual survey conducted by in4ma and sponsored by IPC, the electronics manufacturing services (EMS) industry in Europe experienced negative 14 percent growth in printed circuit board assembly (PCBA) production in 2024.