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The International Electronics Manufacturing Initiative (iNEMI), in conjunction with MIT's FUTUR-IC initiative, is conducting a survey to understand the status of stakeholders, materials, applications, standards and test methods for high-volume deployment of optical adhesives for optoelectronics applications, particularly for silicon photonics and co-packaged optics.
Rapid adoption of applications such as artificial intelligence, high-performance computing and autonomous systems requires efficient, economical, and sustainable hardware solutions. This need is driving rapid developments in photonics and co-packaged optics. Advancements in materials, assembly processes, and test methods for optical adhesives are essential to achieve high-volume manufacturing, lower costs, and environmentally friendly solutions.
The Adhesives Characterization for Optical Packaging (ACOP) Project, a collaborative effort between INEMI and FUTUR-IC, aims to accelerate the development and adoption of economically and environmentally sustainable optical adhesive materials. To learn more about this project and the FUTUR-IC initiative, download the presentation from our December webinar.
Please Share Your Input — Take the Survey
Your participation in the iNEMI / MIT survey will contribute immensely to the progress of this project's goal. The survey is available online and will take approximately 10-20 minutes to complete. Deadline for input is Thursday, January 30, 2025.
Take the survey HERE.
