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IPC Introduces First Standard for In-Mold Electronics

11/18/2024 | IPC
IPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.

U.S. Army Awards RTX's Raytheon TOW Contracts for $676 Million

10/24/2024 | RTX
Raytheon, an RTX business, was awarded $676 million to continue manufacturing the tube-launched, optically-tracked, wireless-guided TOW® weapon system for the U.S. Army.

New Information Now Available for Popular Podcast Series on PCB Design

10/24/2024 | I-Connect007
Exciting news for listeners of On the Line With... PCB 3.0: A New Design Methodology, the popular podcast series hosted by I-Connect007. A 10-page companion guide featuring insights from Cadence's subject matter experts is now available for download.

BOOK EXCERPT: The Printed Circuit Designer’s Guide to... DFM Essentials, Introduction

10/16/2024 | I-Connect007 Editorial Team
Design for Manufacturing (DFM) is defined as the practice of designing printed circuit boards that meet not only the capabilities of the customer’s assembly manufacturing process, but also the capabilities of the board fabrication process to provide the highest reliability at the lowest possible cost. 

Northrop Grumman Selected by US Army to Enhance Aircraft Survivability

08/27/2024 | Northrop Grumman
 Northrop Grumman Corporation has been selected by the U.S. Army to compete in the first phase of the Improved Threat Detection System program, featuring Northrop Grumman’s Advanced Tactical Hostile Engagement Awareness (ATHENA) sensor on an Other Transaction Agreement (OTA) through the Consortium Management Group, Inc., on behalf of the Consortium for Command, Control and Communications in Cyberspace (C5).
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