-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Meeting in Vienna: PCB Designers Invited to Engage in the Silicon to Systems Process
November 8, 2024 | Michelle Te, IPC CommunityEstimated reading time: 1 minute
PCB designers interested in innovative ideas, technical prowess, relevance, quality, and doing their best work can now register for the inaugural Pan-European Electronics Design Conference (PEDC), Jan. 29-30, 2025, in Vienna, Austria.
“It’s a platform where the European electronics design community can meet, exchange ideas, and get updates on state-of-the-art knowledge and ongoing developments,” says Peter Tranitz, senior director, solutions, IPC Electronics Europe GmbH. “This format has been asked for by industry leaders in the course of the discussions with our European policy meetings in Brussels, when the European Chips Act was close to being passed.”
PEDC is co-hosted by IPC Europe and FED, the German electronics design and manufacturing association, with marketing support from IPC and I-Connect007. It is designed to connect the European EE industry and the scientific community. It includes two days of lectures and expert panels in two parallel thematic blocks on technologies and processes for the development and production of electronic assemblies and systems. There will also be a keynote and an evening networking event.
Topics will include development, design for excellence, software and tools, and the design process of electronic systems. All presentations will be in English.
“Our aim with this format is to bring the industry together and offer a platform for exchanging knowledge,” says Christoph Bornhorn, executive director of FED. “Experts meet, exchange ideas, and network on an international level. This can result in projects and innovations that ultimately benefit the entire industry.”
Continue reading this article in the Fall 2024 issue of IPC Community.
Suggested Items
SEMI Publishes Recommendations for Semiconductor Policies in the 2024-2029 European Commission Legislative Term
12/05/2024 | SEMISEMI, the industry association serving the global electronics design and manufacturing supply chain, published recommendations for the European Union to bolster its semiconductor ecosystem.
SEMI Publishes Recommendations for Semiconductor Policies in the 2024-2029 European Commission Legislative Term
12/02/2024 | SEMISEMI, the industry association serving the global electronics design and manufacturing supply chain, today published recommendations for the European Union to bolster its semiconductor ecosystem.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
Orbex Welcomes Contract Extension and Additional Funding from ESA’s Boost! Programme
11/19/2024 | OrbexLeading orbital launch services company, Orbex has today welcomed the extension of its contract with the European Space Agency’s (ESA) Boost! Programme and additional funding of €5.6 million.
TI Accelerates Delivery to European Customers; Opens New Product Distribution Center Near Frankfurt, Germany
11/14/2024 | Texas InstrumentsTexas Instruments (TI) announced the opening of its new, state-of-the-art product distribution center in Dreieich, Germany, outside of Frankfurt.