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Dymax to Showcase Innovative Adhesives at COMPAMED 2024
November 8, 2024 | DymaxEstimated reading time: 1 minute
Dymax, a leading manufacturer of rapid curing materials and equipment, will showcase its latest developments in medical technology at this year’s COMPAMED in Düsseldorf, from November 11 to 14, in Hall 8B, Booth L01.
The focus will be on the patented HLC™ (Hybrid Light-Curable) technology. The adhesives in this series represent an advancement of existing UV light-curable adhesives (UVCA), combining the well-known advantages of Dymax products — such as fast curing times and strong physical and performance properties— with the moisture-/contact-curing properties of anionics. This technology enables complete bonding even in hard-to-reach areas or with materials that have low or no light transmission.
Additionally, at the joint booth with Biesterfeld Spezialchemie from Hamburg, Dymax will introduce the novel adhesives of the 2000-MW series. These skin-friendly adhesives are specifically designed for medical wearables and do not contain potentially skin-irritating substances such as IBOA or TPO. They are particularly suitable for devices that come into direct contact with the skin, such as blood glucose monitors, injectors, and patient monitoring devices.
Visitors to COMPAMED will also have the opportunity to learn about Dymax's latest UV and LED curing equipment. This includes the BlueWave® QX4 V2.0 LED spot curing system and the BlueWave® AX-550 V2 LED flood curing system. Dymax experts will be on-site to answer questions and demonstrate the applications of these technologies.
Michael Ford, Director of Business Development & Product Management at Dymax, emphasizes: “COMPAMED is of central importance to us. We are excited to once again prove our capabilities and show how our innovative products meet the demands of medical device manufacturers. As a reliable partner, we help optimize and enhance the efficiency of their operations.”
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Dymax to Showcase Expanding Range of Light-Cure Solutions for Electronics at SMTA International 2024
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Altus, Danutek Announce Strategic New Partnership with actnano
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BOOK EXCERPT: The Printed Circuit Assembler’s Guide to... Encapsulating Sustainability for Electronics, Chapter 2
07/03/2024 | I-Connect007 Editorial TeamThere are many important things to consider when applying an encapsulant. Chapter 2 of this book is an overview of the application process that covers many of the terms and definitions found on a technical data sheet and discusses the primary considerations for each of the process stages. It is worthwhile considering some of the terms and definitions found on a technical data sheet to understand how the different liquid, mixed system, and cured property values can dictate the method chosen to apply materials.