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Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
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Electronics Manufacturing Association Statement on U.S. Election Results
November 8, 2024 | IPCEstimated reading time: Less than a minute
John Mitchell, President and CEO of IPC, the global electronics manufacturing industry association, issued the following statement on the United States’ election results:
“On behalf of thousands of IPC members across the United States, we congratulate President-elect Donald Trump on his election, along with all of the newly elected and re-elected members of Congress. We look forward to working with the new Administration and Congress to advance policies that promote innovation, investment, and resilience over the coming decade.
“We worked with the 2016-2020 Trump administration to raise awareness of the electronics industry’s importance to national and economic security, and we will continue to do so over the coming years. Electronics are at the heart of the modern economy, and the U.S. Government needs to overcome decades of neglect and do more to ensure the industry’s long-term success.”
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IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
Disruptive Innovation and Generative AI Inventor, Kevin Surace, to Keynote IPC APEX EXPO 2025
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Keysight Providing Software to Enable Researchers through the Microelectronics Commons
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Neways Partners with MilDef for the Production of Advanced Electronic Components
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