AIM to Present on Micro/MiniLED Applications at Hangjia Talk in Shenzhen, China

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AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming Hangjia annual industry event focused on the future of the LED display sector. Taking place at the Crowne Plaza Shenzhen WECC in Shenzhen, China, November 20-21, this year’s event will delve into emerging trends, challenges, and advancements that will shape 2025 for the LED display industry.

AIM Product Manager, Diego Jiang, will share expertise and the latest advancements in micro and miniLED soldering technology. As the LED display industry continues to evolve, AIM Solder remains at the forefront by developing high-performance soldering materials tailored for micro and miniLED applications. Diego Jiang’s presentation will cover the critical innovations AIM has pioneered in solder pastes, fluxes, and other assembly materials essential for creating displays with finer pitches, enhanced reliability, and improved efficiency. His talk will also explore how AIM’s advanced materials help manufacturers meet the exacting demands of these rapidly developing markets and address the challenges anticipated in the coming year.