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ICT and functional test play critical roles in the electronics manufacturing process. In many cases, these processes are the final line of defense in identifying defects, preventing failures from reaching the end user, and safeguarding a manufacturer's reputation.
A growing problem in this area has been the sheer increase in production output from the SMT line. As components get smaller, PCBs will continue shrinking, allowing engineers to design highly panelized products. SMT processes such as printing, placement, and 3D inspection have kept pace with these developments, while traditional testing methods have not scaled to the same degree. The growing mismatch between SMT line speeds and offline test cells has led to higher costs, increased scrap, and significant operational inefficiencies, especially in these highly panelized products.
How do we solve this problem? Automation of course. Over the years, developments in ICT and functional test technology have significantly closed the gap between SMT production and the test process, leading to major shifts in how this process is approached. I’ll explore the unique challenges associated with the test area, and the key benefits to investing in an automated approach.
Continue reading this article in the November 2024 issue of SMT007 Magazine.
