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Automating Test Processes in Modern PCBA Manufacturing
November 12, 2024 | Josh Casper, Horizon SalesEstimated reading time: 1 minute

ICT and functional test play critical roles in the electronics manufacturing process. In many cases, these processes are the final line of defense in identifying defects, preventing failures from reaching the end user, and safeguarding a manufacturer's reputation.
A growing problem in this area has been the sheer increase in production output from the SMT line. As components get smaller, PCBs will continue shrinking, allowing engineers to design highly panelized products. SMT processes such as printing, placement, and 3D inspection have kept pace with these developments, while traditional testing methods have not scaled to the same degree. The growing mismatch between SMT line speeds and offline test cells has led to higher costs, increased scrap, and significant operational inefficiencies, especially in these highly panelized products.
How do we solve this problem? Automation of course. Over the years, developments in ICT and functional test technology have significantly closed the gap between SMT production and the test process, leading to major shifts in how this process is approached. I’ll explore the unique challenges associated with the test area, and the key benefits to investing in an automated approach.
Continue reading this article in the November 2024 issue of SMT007 Magazine.
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TRI to Exhibit at SMTA Queretaro Expo 2025
07/16/2025 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, is pleased to announce plans to exhibit at the SMTA Querétaro Expo 2025, scheduled to take place on July 24, 2025, at the Querétaro Centro de Congresos y Teatro Metropolitano.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
Meet the Author Podcast: Martyn Gaudion Unpacks the Secrets of High-Speed PCB Design
07/16/2025 | I-Connect007In this special Meet the Author episode of the On the Line with… podcast, Nolan Johnson sits down with Martyn Gaudion, signal integrity expert, managing director of Polar Instruments, and three-time author in I-Connect007’s popular The Printed Circuit Designer’s Guide to... series.
TTCI Joins Printed Circuit Engineering Association to Strengthen Design-to-Test Collaboration and Workforce Development
07/09/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is proud to announce its membership in the Printed Circuit Engineering Association (PCEA), further expanding the company’s efforts to support cross-functional collaboration, industry standards, and technical education in the printed circuit design and manufacturing community.
Study on Resonance Mitigation in Metallic Shielding for Integrated Circuits
07/08/2025 | Maria Cuesta-Martin, Victor Martinez, Vidal Gonzalez Aguado, Würth ElektronikInherent cavity resonant modes often lead to significant degradation of shielding effectiveness, responsible for unwanted electromagnetic coupling. Cavity resonant modes of the metal shielding enclosure can produce two adverse problems: the mutual coupling among different RF modules and shielding effectiveness reduction of the metal enclosure. The cabinets serve to shield certain components from electromagnetic interference (EMI). However, these cavities present some resonance peaks at 5 GHz, making it impossible to use them at higher frequencies.