Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
DuPont to Feature Innovative Electronics Products and Solutions at Electronica 2024
November 13, 2024 | DuPontEstimated reading time: 2 minutes
As the demand for advanced technology surges, DuPont will be featuring its extensive portfolio of innovative products and solutions at Electronica 2024, the world’s premier trade fair for electronics, November 12-15 in Munich. Meet us at the nexus of innovation: Hall B3, Stand Number 562 and discover our transformative vision for the electronics landscape under the banner: “One Stop Powerhouse for Advanced Interconnect and Thermal Management.”
"Electronica 2024 is a pivotal platform for showcasing our commitment to innovation in the electronics sector," said Sebastien Chaudet, Europe General Manager for DuPont Interconnect Solutions. "We’re eager to connect with industry leaders, partners, and customers to discuss how our advanced technologies can propel your projects forward and drive mutual success."
The DuPont booth promises to be a treasure trove of exciting, pioneering products and solutions tailored to meet the dynamic demands of the electronics sector. Several products and technologies will be on display, including:
- Laird Performance Materials provide electronic devices with innovative protection solutions in electromagnetic and thermal management across industries such as automotive, aerospace, medical, computing, telecom, AI, datacenter and more.
- Solderon™ and Silveron™ metallization processes address the connector industry's needs for critical component reliability, ensuring signal integrity and low contact resistance with sustainable, durable, high-efficiency, and cost-optimized plating solutions.
- Silver Nanowire Technologies enable transparent conductors (inks and films) with ultra-flexibility and excellent optics ideal for transparent heater, display touch, shielding, and more in next-generation automotive and display technologies.
- Pyralux® Flexible Laminates provide exceptional flexibility and high thermal performance, making them ideal for multilayer circuits, ensuring reliability and efficiency in applications ranging from automotive to telecommunications.
In addition to our extensive product lineup, we are excited to present an immersive multimedia experience featuring:
- Advanced Computing and AI Solutions: DuPont develops and manufactures products of unmatched quality and reliability under two powerhouse portfolios, advanced interconnect and thermal management, that address the complex performance demands of AI chip packaging and boards and enable future innovation.
- Next-Generation Automotive Applications: Learn about our specialized materials designed for electric vehicles and autonomous driving technologies that focus on safety and efficiency.
- Printed Circuit Boards: Discover how our advanced solutions ranging from advanced packages, Integrated Circuit (IC) substrates, and rigid (flexible) printed circuit solutions are essential for ensuring reliability and performance in addressing thermal management and signal integrity challenges.
Join us at Electronica 2024 for product demonstrations and firsthand experience with our innovative solutions. Meet our knowledgeable team for expert consultations and personalized discussions on addressing your specific challenges. Discover how DuPont can be your trusted partner in advancing innovation and achieving your business goals
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Element Solutions Declares Q3 Dividend of $0.08 Per Share
08/22/2025 | BUSINESS WIREElement Solutions Inc announced that its board has declared a quarterly cash dividend of $0.08 per share of the company's common stock. The declared dividend will be paid on September 15, 2025 to stockholders of record as of the close of business on September 2, 2025.
Polymatech Electronics Limited Announces Completion of PCB Manufacturing Facility in Europe
08/15/2025 | PR NewswirePolymatech Electronics Limited is thrilled to announce the successful commissioning of its state-of-the-art Printed Circuit Board (PCB) manufacturing facility in Estonia, Europe. This milestone represents a significant advancement in the company's strategic expansion across the European market.
MacDermid Alpha Electronics Solutions Announces New Strategy Vice President Role for India
08/14/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is pleased to announce the appointment of Dr. Ravi Bhatkal to the newly created role of Vice President, Strategy, India.
Changes in Management Positions at Würth Elektronik eiSos Group
08/14/2025 | Wurth Elektronik eiSosWürth Elektronik, a leading manufacturer of electronic and electromechanical components for the electronics industry, announces two new appointments at the management level: Dirk Knorr has taken over the position of COO of the Würth Elektronik eiSos Group, and Sebastian Valet has taken over his previous position as Managing Director of Würth Elektronik eiSos GmbH & Co. KG.