-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLearning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Ventec to Become Primary PCB Materials Supplier for Teltonika
November 13, 2024 | VentecEstimated reading time: 1 minute

Ventec International Group and high-tech design and manufacturing company Teltonika announce that Ventec is to become supply chain partner and primary supplier of PCB base materials to Teltonika, which is preparing to open a new PCB manufacturing plant at its base in Vilnius, Lithuania.
Teltonika has a wide range of innovative products and services, including telemetry and IoT (Internet of Things) devices, energy systems including EV-charging solutions, advanced medical equipment, and networking, with ODM and EMS services including PCB assembly, testing, and box-build. The new PCB manufacturing plant will produce high-performance boards for use within Teltonika’s own product divisions and to commercial EMS customers.
Ventec has a broad portfolio of substrate materials to fulfil Teltonika’s wide-ranging production needs, including a selection of lead-free FR4 formulas, as well as advanced halogen free FR15.1 materials. In addition, Ventec’s low-loss materials cover a wide performance spectrum for efficiency-focused, high-speed networking and computing systems, and thermal substrates help maximize reliability in highly dissipative applications such as power conversion, and rapid EV charging.
“With their extensive and high-performing product portfolio, resilient, integrated supply chain, local logistical and technical support, and commitment to ongoing technological development, Ventec is the perfect supplier to support our new PCB manufacturing division,” said Tomas Auruškevičius, CEO of Teltonika’s PCB manufacturing plant. “As we ramp up in-house PCB production to support our diverse electronic manufacturing activities, we expect this to be a long and successful collaboration, founded on our mutual commitment to sustainability and reliance on creative supply chain and technical innovation.”
“We are excited to win the trust of Teltonika and bring our fully owned distribution and service center model to the project, which will deliver a powerful boost to PCB manufacturing in Europe,” said Jason Chung, Ventec International Group CEO. “We have committed ourselves over many years to developing our model, which combines global reach with high levels of local service and support.”
“Teltonika has recognized our capability to deliver technically advanced products, efficiently, and tailor the supply chain to meet our customers’ service, technical and commercial goals, with full local support from Ventec personnel,” added Mark Goodwin, COO of Ventec. “This is another strong validation of our work and commitment to the EMEA market.”
Suggested Items
Technica USA Showcases PCBA Supply Partners at IPC APEX EXPO 2025
03/13/2025 | Technica USATechnica USA is thrilled to highlight its full portfolio of PCBA supply partners at the 2025 APEX/IPC Expo in Anaheim, California. Featuring some of the world’s leading suppliers, Technica’s PCBA product lineup continues to drive innovation and excellence in the industry.
Aismalibar to Showcase Advanced Thermal Management Solutions at APEC 2025
03/13/2025 | AismalibarAismalibar, a global leader in high-performance thermal management materials, is set to exhibit at APEC 2025 (Applied Power Electronics Conference) in Atlanta, Georgia, from March 16–20, 2025. As the premier event for power electronics professionals, APEC provides a crucial platform for industry leaders to explore the latest advancements in thermal interface materials (TIMs), high-performance PCB laminates, and insulated metal substrates (IMS).
Technica USA Celebrates 40 Years of Excellence in Electronics Manufacturing
03/13/2025 | Technica USATechnica USA, a leading provider of materials, equipment, installation, and services for the printed circuit board (PCB) fabrication, PCB Assembly, substrates, MEMS, and semiconductor industries, proudly announces its 40th anniversary in 2025.
Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
03/13/2025 | John Watson -- Column: Elementary, Mr. WatsonAt the 2020 Tokyo Summer Olympics, the U.S. men's 4x100-meter relay team had high hopes of winning a medal. The team comprised some of the fastest sprinters in the world, but something went wrong. In a relay, four runners must smoothly pass their baton to the next runner inside a zone on the track. If a runner drops the baton or it’s passed outside the zone, the team risks disqualification. The U.S. team’s pass between the second and third runner was messy, slowing them down. By the time the last runner received the baton, the team had lost too much time. They finished sixth in their heat and didn’t qualify for the final.
MicroCraft to Unveil Three New Models at IPC APEX EXPO 2025
03/12/2025 | MicroCraftMicroCraft, a global leader in PCB testing and precision inkjet printing solutions, is set to showcase three cutting-edge models at IPC APEX EXPO 2025 at the Anaheim Convention Center March 18-20 in booth #4105. Each model represents the latest advancements in speed, accuracy, and automation across MicroCraft’s three product lines.