-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAlternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
Wet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
BOOK EXCERPT: The Printed Circuit Designer’s Guide to... DFM Essentials, Chapter 2
November 14, 2024 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
The Printed Circuit Designer’s Guide to... DFM Essentials
by Anaya Vardya, American Standard Circuits / ASC Sunstone Circuits
Chapter 2: Panelization
Panelization is the process of placing one or more PCBs on a manufacturing panel and incorporating features to assist manufacturing (such as tooling holes, fiducials, coupons, panel thieving, etc.). Panelization is one of the highest impact factors in the cost of a PCB.
The panel area available for circuit boards plus coupons is known as the usable area (Figure 2.1). Test coupons are added by the fabricator to the perimeter of the manufacturing panel outside the usable area. The number and type of coupons are based on the specs that the PCBs are being built to and requirements for controlled impedance. Coupons may sometimes further reduce the amount of a PCB panel that is available for the circuit boards. This is defined by the fabricator as required perimeter for coupons. This is typically about 1 inch or 25.4 mm and is a fixed area based on panel size. Panel utilization is measured as a percentage, defined by the total area for PCBs divided by the total panel area.
Cost-effective material utilization is defined by a target panel with greater than 75% panel utilization. Raw laminate is one of the primary cost constituents of a multilayer PCB. Optimizing panel structures around standard base materials while achieving maximum material utilization on one of the standard panel sizes can have a significant impact on multilayer board prices and deliveries. The three most preferred sizes in North America are 12x18 inches, 18x24 inches and 21x24 inches, with 18x24 inches being the most common. For special applications, other panel sizes can be provided. In Asia, typically the shops will process custom panel sizes in order to maximize utilization. The most effective cost per unit area processed is usually found with a larger panel size.
Visit the I-Connect007 library to continue reading The Printed Circuit Designer’s Guide to DFM Essentials.
Suggested Items
Smartphone Panel Shipments to Dip by 1.7% in 2025, with Chinese Manufacturers’ Share Expected to Exceed 70%
11/13/2024 | TrendForceTrendForce’s latest investigations reveal that while the overall smartphone market is projected to grow by just 3% in 2024, increased demand for refurbishes and second-hand devices is fueling growth in the smartphone panel market. Shipments this year are estimated to grow 6.7% YoY to reach 2.066 billion units.
Automating Test Processes in Modern PCBA Manufacturing
11/12/2024 | Josh Casper, Horizon SalesICT and functional test play critical roles in the electronics manufacturing process. In many cases, these processes are the final line of defense in identifying defects, preventing failures from reaching the end user, and safeguarding a manufacturer's reputation. A growing problem in this area has been the sheer increase in production output from the SMT line. As components get smaller, PCBs will continue shrinking, allowing engineers to design highly panelized products.
TTM’s Grand Opening in Malaysia
11/07/2024 | Marcy LaRont, I-Connect007When I last spoke with Tom Edman, president and CEO of TTM Technologies (TTM), he provided an update about the company’s new high-tech printed circuit board facility under construction in Syracuse, New York, and how the grand opening of a facility in Malaysia is informing TTM’s overall expansion efforts: a cutting-edge facility spread across 27 acres and providing roughly 1,000 jobs. Now, Tom provides more details about the new automated facility, its regional and global impact, and the importance of having both government and industry support.
Altus Sees Growing Interest for Laser Depanelling Solutions
11/04/2024 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, has seen an increasing interest in laser depaneling systems from LPKF in 2024.
The Chemical Connection: Troubleshooting PCB Process Problems
10/29/2024 | Don Ball -- Column: The Chemical ConnectionAs a supplier of PCB wet processing equipment, we inevitably find ourselves involved in helping customers solve sudden process problems that may or may not be caused by equipment malfunctions. For the most part, equipment problems are relatively easy to identify and repair: sensors for chemistry and equipment control, clogged nozzles and filters, leaks in the plumbing, etc. But what happens when the equipment checks out and the problem is still there?