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Laser Photonics Corporation, a leading global developer of industrial laser systems for cleaning and other material processing applications, and its subsidiary, Control Micro Systems (CMS Laser), announced the expansion of their Printed Circuit Board (PCB) Depaneling technology development project for the electronics market.
Laser processing has emerged as an effective method of PCB depaneling due to its non-contact nature, narrow kerf width, and precision. This method eliminates part-induced stress and the need for consumables like cutting oils, ensuring cleanliness and high-quality results.
Custom-tailored depaneling laser technology by CMS Laser features high speed, pinpoint accuracy and machine vision alignment. The company offers PCB depaneling systems integrating CO2 and UV laser types. The main deciding factor when determining which laser to use is the relative importance of cycle time versus the cleanliness of the cut edge. CO2 lasers provide fast cuts and cost efficiency, while UV lasers offer clean cuts with minimal charring.
“By bringing together the talented engineers and technicians of Control Micro Systems and Laser Photonics, we plan to boost the development of PCB depaneling systems to meet the growing demand in the market,” said John Armstrong, Executive Vice President of LPC.
Many manufacturers have chosen laser routing as it’s ideal for flexible, highly sensitive, small PCBs used across electronic devices. CMS Laser’s solutions offer precision and efficiency suitable for standalone or integrated SMT line operations.
CMS Laser’s Class I PCB depaneling systems feature Through the Optics Vision (TTOV) for precise processing and data verification and include CMS Process Engine software, offering a user-friendly interface and optional production line communication. Easy setup and quick changeovers ensure high throughput with excellent accuracy and repeatability, delivering high yield and customer value.
Leveraging CMS Laser’s specialized expertise, LPC is channeling resources into R&D in the PCB manufacturing area, aligning with its comprehensive diversification strategy. This move aims to enhance shareholder value and build resilience in evolving markets.
