Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Boeing Delivers Advanced O3b mPOWER Satellites to Operator SES

11/14/2024 | Boeing
Boeing teams have successfully delivered the 7th and 8th O3b mPOWER satellites to SES. These satellites, featuring Boeing’s advanced software-defined communications payload, are being transported to Cape Canaveral for a planned launch in December.

Siemens Unveils Next Generation AI-enhanced Electronic Systems Design Software

11/13/2024 | Siemens
Siemens Digital Industries Software announced today the latest advancement in its electronic systems design portfolio. The next generation release takes an integrated and multidisciplinary approach, bringing together Xpedition™ software, Hyperlynx™ software and PADS™ Professional software into a unified user experience that delivers cloud connectivity and AI capabilities to push the boundaries of innovation in electronic systems design.

Renesas Unveils Industry’s First Automotive Multi-Domain SoC Built with 3-nm Process Technology

11/13/2024 | Renesas
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, launched the new generation of automotive fusion system-on-chips (SoCs), serving multiple automotive domains including Advanced Driver Assistance Systems (ADAS), in-vehicle infotainment (IVI), and gateway applications on a single-chip.

Gartner Forecasts India IT Spending to Reach $160 Billion in 2025

11/12/2024 | Gartner, Inc.
India IT spending is projected to total $160 billion in 2025, an increase of 11.2% from 2024, according to the latest forecast by Gartner, Inc.

Agileo Automation Launches E84 PIO Box at SEMICON Europa

11/12/2024 | Agileo Automation
Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor equipment manufacturers, today launches the E84 PIO Box at Booth #C2848.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in